Senior Manager, Advanced Packaging Process Engineering

Applied Materials, Inc.; Singapore; On-site; SGD 180,000 - 300,000; Full time

Job summary

Applied Materials, Inc. in Singapore seeks a seasoned engineering leader to drive next‑generation packaging technologies. You will guide PVD/CVD/ALD processes, shape roadmaps, and collaborate with customers and cross‑functional teams to solve high‑value challenges.

The role requires strong technical depth in thin‑film deposition and demonstrated leadership, with the ability to manage complex hardware characterization and demonstrations for a broad product range.

Qualifications

• Demonstrates deep technical expertise in semiconductor thin-film deposition: PVD, CVD, ALD.
• Experience leading teams to address complex HW challenges.
• Strong communication and cross-functional collaboration skills.

Responsibilities

• Lead the development and scaling of next-generation packaging technologies (PVD/CVD/ALD).
• Drive technology roadmaps for advanced packaging and 3D integration with customers and engineering teams.
• Manage engineers in hardware characterization and new tech development for complex systems.
• Interact with customers to resolve high-value process challenges across product ranges.
• Lead demonstrations of product/technology to internal and external stakeholders.

Skills

Thin-film deposition

Leadership

Communication

Customer collaboration

Job description

Applied Materials, Inc. in Singapore seeks a seasoned engineering leader to drive next‑generation packaging technologies. You will guide PVD/CVD/ALD processes, shape roadmaps, and collaborate with customers and cross‑functional teams to solve high‑value challenges.

The role requires strong technical depth in thin‑film deposition and demonstrated leadership, with the ability to manage complex hardware characterization and demonstrations for a broad product range.