Senior Process Engineer - Advanced Packaging Innovator

ASM; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

ASM in Singapore is seeking a Principal/Senior Process Engineer to advance semiconductor process technologies, focusing on thin-film deposition and advanced packaging. You will drive DOE/RSM-based experiments, mentor engineers, and collaborate with customers to demonstrate capabilities across packaging platforms.

Ideal candidates bring 10+ years in deposition and packaging, experience with D2W/W2W bonding, and strong materials characterization skills to influence product performance and enable

Qualifications

• Bachelor's/Master's/PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• 10+ years of combined education, research, and work experience in thin-film deposition and advanced packaging.
• Direct experience with D2W/W2W Hybrid bonding and surface preparation steps.
• Proficiency with materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry).
• Knowledge of electrical characterization techniques for CMOS devices.

Responsibilities

• Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions (ALD, PECVD, PVD, ECP) and surface preparation.
• Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
• Develop new films or processes for emerging packaging applications like W2W/D2W Hybrid bonding and perform advanced materials characterization.
• Provide mentorship to Process Engineers and lead technical problem-solving sessions using Ishikawa diagrams.
• Collaborate with customers and marketing teams to define requirements and execute demonstrations.
• Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers.
• Draft technical papers, generate Intellectual Property, and present findings to professional audiences.
• Travel up to 10% to support remote sites and customer engagements.
• May supervise process engineering technicians and provide input on performance evaluations.

Skills

Thin-film deposition

Advanced packaging

DOE & RSM

Surface preparation

Materials characterization

Education

Bachelor’s/Master’s/PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics

Tools

XPS

SIMS

RBS

AFM

XRR

XRD

TEM

SEM

Ellipsometry

Job description

ASM in Singapore is seeking a Principal/Senior Process Engineer to advance semiconductor process technologies, focusing on thin-film deposition and advanced packaging. You will drive DOE/RSM-based experiments, mentor engineers, and collaborate with customers to demonstrate capabilities across packaging platforms.

Ideal candidates bring 10+ years in deposition and packaging, experience with D2W/W2W bonding, and strong materials characterization skills to influence product performance and enable