6723 - Senior Advanced Packaging Application Engineer (Thermo Compression Bonding - TCB)

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

The Supreme HR Advisory PTE. LTD. is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding - TCB) based in Admiralty, Singapore.

The role requires guiding customers, translating roadmaps into equipment specs, and driving process development across advanced packaging technologies. You will lead qualification activities, optimize bond processes, and collaborate with cross-functional teams to deliver reliable, high-yield packaging solutions including 2.5D/3D, CoWoS,

Qualifications

• Bachelor's or Master's Degree in one of the listed engineering disciplines.
• Minimum 5 years experience in semiconductor advanced packaging.
• Hands-on experience in TCB, advanced packaging, Flip Chip, NPI, process qualification, equipment qualification.
• Experience with HBMs, CoWoS, CoPoS, chiplets, 2.5D/3D packaging.
• Strong understanding of bond processes, SPC, DOE, yield, reliability, warpage, and thermal management.

Responsibilities

• Translate customer roadmaps into equipment specifications.
• Participate in technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather feedback and recommend product enhancements.
• Develop and support applications for TCB, Flip Chip, Hybrid Bonding, and related packaging.
• Evaluate and optimize bond force, temperature profiles, and process windows.
• Define machine architecture and specifications with engineering teams.
• Lead machine qualification efforts: FAT/SAT and customer buyoff.

Skills

TCB

Advanced packaging

Process qualification

DOE

Yield improvement

Reliability testing

Failure analysis

Thermal management

Alignment accuracy

SPC

Chiplet integration

2.5D/3D packaging

Education

Semiconductor Engineering

Materials Engineering

Mechanical Engineering

Electrical Engineering

Chemical Engineering

Physics

Related Engineering disciplines

Tools

TCB equipment

ASMPT

BESI

Toray

Panasonic

Kulicke & Soffa

Job description

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding - TCB)

Location: Admiralty

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : SGD 8,000 - SGD 10,000/month (Based on experience and technical capability).

Responsibilities

• Customer Application Engineering
  • Understand customer packaging roadmaps and manufacturing requirements.
  • Translate process requirements into equipment specifications.
  • Participate in customer technical discussions and application reviews.
  • Support technical sales activities and customer demonstrations.
  • Gather customer feedback and recommend future product enhancements.
• Advanced Packaging Process Development
  • Develop and support applications involving:
    • Thermo Compression Bonding (TCB)
    • Flip Chip Assembly
    • Hybrid Bonding
    • HBM Packaging
    • CoWoS
    • CoPoS
    • 2.5D Packaging
    • 3D Packaging
    • Chiplet Integration
    • Large Die Packaging
  • Evaluate and optimize:
    • Bond force
    • Temperature profiles
    • Process windows
    • Alignment accuracy
    • Package warpage
    • Yield
    • Reliability
• Equipment Development
  • Work closely with multidisciplinary engineering teams to define:
    • Machine architecture
    • Functional specifications
    • Accuracy requirements
    • Throughput targets
    • Thermal performance
    • Bonding process capability
    • Reliability requirements
    • Customer acceptance criteria
  • Provide technical guidance throughout equipment development.
• Machine Qualification
  • Serve as the internal customer during equipment development.
  • Responsibilities include:
    • Defining machine acceptance criteria
    • Process qualification
    • FAT and SAT support
    • Customer buyoff support
    • Qualification reporting
    • Continuous performance improvement
• Technology & Market Intelligence
  • Monitor industry developments in:
    • Advanced packaging technologies
    • Semiconductor manufacturing trends
    • Customer requirements
    • Competitor equipment
    • Emerging packaging architectures
  • Support future product strategy and technology roadmap planning.

Requirements

• Bachelor's or Master's Degree in:
  • Materials Engineering
  • Mechanical Engineering
  • Electrical Engineering
  • Chemical Engineering
  • Physics
  • Semiconductor Engineering
  • Related Engineering disciplines
• Minimum 5 years experience in semiconductor advanced packaging.
• Hands-on experience in one or more of the following:
  • Thermo Compression Bonding (TCB)
  • Advanced Packaging Process Development
  • Flip Chip Assembly
  • New Product Introduction (NPI)
  • Process Qualification
  • Equipment Qualification
  • Manufacturing Engineering
  • Customer Process Development
• Experience supporting advanced package technologies such as:
  • HBM
  • CoWoS
  • CoPoS
  • Chiplets
  • 2.5D Packaging
  • 3D Packaging
  • Large Die Packaging
• Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.
• Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.
• Strong understanding of:
  • Thermo Compression Bonding (TCB)
  • Semiconductor Packaging
  • Flip Chip Assembly
  • Process Qualification
  • SPC
  • DOE
  • Yield Improvement
  • Reliability Testing
  • Failure Analysis
  • Package Warpage
  • Thermal Management
  • Alignment Accuracy
  • Semiconductor Manufacturing Processes
• Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.