(UP$10K) Packaging Application Engineer (Thermo Compression Bonding) {hkhdv}

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

The Senior Advanced Packaging Application Engineer (TCB) in Woodlands/Sembawang, Singapore, will drive customer success through advanced packaging applications, focusing on Thermo Compression Bonding and related technologies. You will translate customer needs into equipment specs and support in-depth discussions with clients.

The role requires hands-on experience in TCB, flip chip, and 2.5D/3D packaging, with a strong track record in process qualification, equipment qualification, and

Qualifications

• Bachelor’s or Master’s degree in Materials Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, Semiconductor Engineering or related disciplines
• Minimum 5 years experience in semiconductor advanced packaging
• Hands-on experience in Thermo Compression Bonding (TCB)
• Hands-on experience in Advanced Packaging Process Development
• Hands-on experience in Flip Chip Assembly
• Hands-on experience in New Product Introduction (NPI)
• Hands-on experience in Process Qualification and Equipment Qualification
• Experience in Manufacturing Engineering and Customer Process Development
• Experience with HBMs, CoWoS, CoPoS, Chiplets, 2.5D/3D Packaging, Large Die Packaging
• Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration is highly regarded

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Develop and support applications involving Thermo Compression Bonding, Flip Chip Assembly, 2.5D/3D packaging, etc.
• Evaluate and optimize bond force, temperature profiles, process windows, alignment accuracy, packager warpage, yield, and reliability.
• Work with multidisciplinary teams to define machine architecture, specifications, and throughput targets.
• Provide technical guidance throughout equipment development.
• Serve as internal customer during equipment development.
• Monitor industry developments in advanced packaging and support roadmap planning.

Skills

TCB technology

Semiconductor packaging

Flip chip assembly

NPI

Process qualification

Equipment qualification

Manufacturing engineering

Customer process development

Yield improvement

Reliability testing

Failure analysis

Package warpage

Thermal management

Alignment accuracy

Semiconductor manufacturing processes

AI accelerator packaging (adv)

Education

Bachelor’s or Master’s Degree in Materials Engineering, Mechanical Eng, Electrical Eng, Chemical Eng, Physics, Semiconductor Engineering or related disciplines

Tools

TCB equipment knowledge (ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa)

Job description

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding - TCB)

Location: Woodlands/Sembawang

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : SGD 8,000 - SGD 10,000/month (Based on experience and technical capability).

Responsibilities

Customer Application Engineering

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

• Develop and support applications involving:
  • Thermo Compression Bonding (TCB)
  • Flip Chip Assembly
  • Hybrid Bonding
  • HBM Packaging
  • CoWoS
  • CoPoS
  • 2.5D Packaging
  • 3D Packaging
  • Chiplet Integration
  • Large Die Packaging
• Evaluate and optimize:
  • Bond force
  • Temperature profiles
  • Process windows
  • Alignment accuracy
  • Package warpage
  • Yield
  • Reliability

Equipment Development

• Work closely with multidisciplinary engineering teams to define:
  • Machine architecture
  • Functional specifications
  • Accuracy requirements
  • Throughput targets
  • Thermal performance
  • Bonding process capability
  • Reliability requirements
  • Customer acceptance criteria

Provide technical guidance throughout equipment development.

Machine Qualification

Serve as the internal customer during equipment development.

Responsibilities include:

• Defining machine acceptance criteria
• Process qualification
• FAT and SAT support
• Customer buyoff support
• Qualification reporting
• Continuous performance improvement

Technology & Market Intelligence

• Monitor industry developments in:
  • Advanced packaging technologies
  • Semiconductor manufacturing trends
  • Customer requirements
  • Competitor equipment
  • Emerging packaging architectures
• Support future product strategy and technology roadmap planning.

Requirements

• Bachelor's or Master's Degree in:
  • Materials Engineering
  • Mechanical Engineering
  • Electrical Engineering
  • Chemical Engineering
  • Physics
  • Semiconductor Engineering
  • Related Engineering disciplines
• Minimum 5 years experience in semiconductor advanced packaging.
• Hands-on experience in one or more of the following:
  • Thermo Compression Bonding (TCB)
  • Advanced Packaging Process Development
  • Flip Chip Assembly
  • New Product Introduction (NPI)
  • Process Qualification
  • Equipment Qualification
  • Manufacturing Engineering
  • Customer Process Development
• Experience supporting advanced package technologies such as:
  • HBM
  • CoWoS
  • CoPoS
  • Chiplets
  • 2.5D Packaging
  • 3D Packaging
  • Large Die Packaging
• Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.
• Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.
• Strong understanding of:
  • Thermo Compression Bonding (TCB)
  • Semiconductor Packaging
  • Flip Chip Assembly
  • Process Qualification
  • SPC
  • DOE
  • Yield Improvement
  • Reliability Testing
  • Failure Analysis
  • Package Warpage
  • Thermal Management
  • Alignment Accuracy
  • Semiconductor Manufacturing Processes
• Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.