TCB Senior Advanced Packaging Application Engineer ( Flip Chip Assembly / Up to $10k ) - 8890

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

THE SUPREME HR ADVISORY PTE. LTD. is seeking a Senior Advanced Packaging Application Engineer specializing in Thermo Compression Bonding (TCB).

The role centers on customer application engineering, translating requirements into equipment specs, and supporting demonstrations and technical discussions. You will work on advanced packaging processes such as TCB, flip chip, 2.5D/3D packaging, CoWoS/CoPoS, and assist with process development, qualification, and reliability objectives.

Qualifications

• Bachelor's or Master's in Engineering/Physics or related field.
• Minimum 5 years in semiconductor advanced packaging.
• Hands-on with TCB, advanced packaging, flip chip, and related processes.
• Experience with NPI, process qualification, and equipment qualification.
• Knowledge of HBM/CoWoS/Chiplets packaging advantageous.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specs and guidance.
• Participate in customer technical discussions and demonstrations.
• Support technical sales activities and customer demos.
• Gather feedback and propose future product improvements.
• Develop and support applications involving Thermo Compression Bonding, 2.5D/3D packaging, and related technologies.
• Evaluate and optimize bond force, temperature profiles, process windows, and alignment accuracy.
• Collaborate with multidisciplinary teams on machine architecture and specs.
• Provide guidance through equipment development and qualification phases.
• Act as internal customer during equipment development and FAT/SAT support.

Skills

TCB expertise

Semiconductor packaging

Process qualification

Yield improvement

DOE

Reliability testing

Alignment accuracy

Thermal management

Education

Bachelor's or Master's in Engineering/Physics

Tools

TCB equipment knowledge

NPI experience

Equipment qualification

Job description

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB)

• Location: Admirax St
• Working Days: 5 Day A Week
• Working hours : 9:00am - 6:00pm
• Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability)

Responsibilities:

Customer Application Engineering

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

- Develop and support applications involving:

• Thermo Compression Bonding (TCB)
• Flip Chip Assembly
• Hybrid Bonding
• HBM Packaging
• CoWoS
• CoPoS
• 2.5D Packaging
• 3D Packaging
• Chiplet Integration
• Large Die Packaging

- Evaluate and optimize:

• Bond force
• Temperature profiles
• Process windows
• Alignment accuracy
• Package warpage
• Yield
• Reliability

Equipment Development

- Work closely with multidisciplinary engineering teams to define:

• Machine architecture
• Functional specifications
• Accuracy requirements
• Throughput targets
• Thermal performance
• Bonding process capability
• Reliability requirements
• Customer acceptance criteria

- Provide technical guidance throughout equipment development.

Machine Qualification

- Serve as the internal customer during equipment development.

- Responsibilities include:

• Defining machine acceptance criteria
• Process qualification
• FAT and SAT support
• Customer buyoff support
• Qualification reporting
• Continuous performance improvement

Technology & Market Intelligence

- Monitor industry developments in:

• Advanced packaging technologies
• Semiconductor manufacturing trends
• Customer requirements
• Competitor equipment
• Emerging packaging architectures

- Support future product strategy and technology roadmap planning.

Requirements:

- Bachelor's or Master's Degree in:

• Materials Engineering
• Mechanical Engineering
• Electrical Engineering
• Chemical Engineering
• Physics
• Semiconductor Engineering
• Related Engineering disciplines

- Minimum5 yearsexperience in semiconductor advanced packaging.

- Hands-on experience in one or more of the following:

• Thermo Compression Bonding (TCB)
• Advanced Packaging Process Development
• Flip Chip Assembly
• New Product Introduction (NPI)
• Process Qualification
• Equipment Qualification
• Manufacturing Engineering
• Customer Process Development

- Experience supporting advanced package technologies such as:

• HBM
• CoWoS
• CoPoS
• Chiplets
• 2.5D Packaging
• 3D Packaging
• Large Die Packaging

- Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.

- Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.

- Strong understanding of:

• Thermo Compression Bonding (TCB)
• Semiconductor Packaging
• Flip Chip Assembly
• Process Qualification
• SPC
• DOE
• Yield Improvement
• Reliability Testing
• Failure Analysis
• Package Warpage
• Thermal Management
• Alignment Accuracy
• Semiconductor Manufacturing Processes

- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.