Package Designer

SILICON BOX PTE. LTD.; Singapore; On-site; SGD 67,000 - 100,000; Full time

Job summary

SILICON BOX PTE. LTD. in Singapore seeks a Package Designer to contribute to product and tooling design, ensuring robust electrical routing and test vehicle concepts.

Candidates with wafer bumping, WLCSP, BGA or fan-out packaging experience are encouraged to apply. Fresh graduates are welcome to join a team that values design guidelines, risk assessment, and cross-functional collaboration in a dynamic manufacturing environment.

Qualifications

• Master's Degree in electrical/electronics engineering or similar.
• Good understanding of design guidelines and able to generate risk assessment reports for Fan-in/Fan-out processes.
• Experience using Cadence APD in RDL routing and mask design for wafer-level processes (Wafer bumping, WLCSP, BGA, eWLB, fan-out) is advantageous.
• Hands-on skills with LinkCAD, Cadence, CAM350, AutoCAD, GDS, and Gerber editors.
• Experience with PCB test board design.
• Fresh graduates are welcome to apply.

Responsibilities

• Generate, update, and revise electrical routing layouts based on netlists or customer designs.
• Generate test vehicle designs and related PCB designs.
• Prepare design risk assessment reports.
• Generate reticle and stencil designs.
• Prepare other schematics or drawings as requested.
• Review, maintain, and update design guidelines.
• Manage conversion of internal design to suppliers' final design.
• Document all drawing revisions and change records.
• Support audits.
• Any other ad-hoc duties as assigned.

Skills

RDL routing

Wafer bumping understanding

PCB test boards

Design guidelines

Risk assessment report

Education

Master's degree in electrical/electronics engineering

Tools

Cadence APD

LinkCAD

CAM350

AutoCAD

GDS

Gerber editors

Job description

Position Summary

The Package Designer is responsible for product and tooling design.

Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.

Responsibilities

With reference to internal design guidelines, work with the internal & external customer to:

• Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.
• Generate test vehicle design and the related PCB design.
• Prepare design risk assessment report.
• Generate reticle and stencil design.
• Generate other schematics or drawing as requested.

Review, maintenance and update the design guidelines.

Manage the conversion of internal design into suppliers' final design.

Document all the drawing revisions and change records.

Support audits

Any other ad-hoc duties as assigned

Requirements

Master's Degree in electrical/ electronics engineering, or similar discipline

Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability

Experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes will be an advantage

Hands-on skills on design software tools like Linkcad, Cadence, CAM350, AutoCAD, GDS, Gerber editors

Experience with PCB test board design

Fresh graduates are welcome to apply