Package Health & Yield Engineer — AI-Driven Testing

Micron; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Micron seeks a Package Health Test Engineer to advance packaging health monitoring, simulation and characterization. You will perform DFT-driven tests, electrical characterization and failure analysis on advanced packages such as HBM.

The role requires hands-on engineering, data analysis and scripting skills, plus collaboration across cross-functional teams to ensure robust test coverage and yield improvements.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, or related field.
• 2+ years of experience in semiconductor industry working on complex products, preferably in packaging or test.
• Experience defining test architectures, coverage, and managing test/probe yield.
• Hands-on with simulation tools and test equipment for package characterization.
• Strong problem-solving, multitasking and communication skills.
• Proficiency with AI/ML tools, statistics, data analysis and scripting (Python, MATLAB, JMP).

Responsibilities

• Develop advanced packaging technology strategies focusing on test architecture and yield.
• Define, validate and optimize test coverage for wafer and die level processes.
• Perform electrical characterization and failure analysis of advanced packages including HBM.
• Identify needs and co-develop new DFTs with cross-functional teams.
• Enhance test fail debugging capabilities to meet probe yield targets.
• Contribute to the APTD product roadmap from a test architecture perspective.
• Collaborate with external partners on customer test flow readiness.

Skills

Test architecture

DFT

Electrical testing

Data analysis

AI/ML tools

Scripting

Education

Bachelor’s or Master’s in Electrical Engineering

Tools

Python

MATLAB

JMP

Job description

Micron seeks a Package Health Test Engineer to advance packaging health monitoring, simulation and characterization. You will perform DFT-driven tests, electrical characterization and failure analysis on advanced packages such as HBM.

The role requires hands-on engineering, data analysis and scripting skills, plus collaboration across cross-functional teams to ensure robust test coverage and yield improvements.