Platform Technology Lead, Advanced Packaging & 2.5D

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 300,000 - 460,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research in Singapore seeks a results-oriented leader to steer platform technology integration in Advanced Packaging. The role focuses on defining a medium-to-long term process capability roadmap and developing 2.5D TSV interposers, integrating optics with electronics via advanced bonding technologies for high-performance networking interconnects.

You will build and mentor a high-performing team, manage cross-functional projects, engage industry

Qualifications

• Bachelor or Master’s degree required in a relevant engineering/science field.
• 15 years of experience in semiconductor industry with expertise in device fabrication and advanced packaging technologies.
• Broad knowledge of lithography, etch, diffusion/thin films, electroplating, CMP, bonding.
• Strong understanding of process development cycles and manufacturing scalability.
• Proven leadership, people management and strategic thinking skills.
• Experience working in a matrixed environment with cross-functional collaboration.

Responsibilities

• Evaluate industry trends and define differentiated platform technology architectures to gain competitive advantage.
• Define simple, cost-effective process flows to realise platform architectures.
• Identify technology gaps and set clear specifications for process modules and accountability for delivery.
• Lead multi-disciplinary teams of designers, integrators, and fabrication partners to realise architectures.
• Engage industry customers from proof of concept to prototyping and manufacturing.
• Act as project leader for industry, consortium, and internal capability projects.
• Mentor and retain a high-performing team and foster innovation across departments.

Skills

Leadership

Project management

Strategic thinking

Team building

Communication

Education

Bachelor or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or related field

Job description

A*STAR - Agency for Science, Technology and Research in Singapore seeks a results-oriented leader to steer platform technology integration in Advanced Packaging. The role focuses on defining a medium-to-long term process capability roadmap and developing 2.5D TSV interposers, integrating optics with electronics via advanced bonding technologies for high-performance networking interconnects.

You will build and mentor a high-performing team, manage cross-functional projects, engage industry