Senior Scientist I, Process Modules

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 150,000 - 230,000; Full time

Job summary

A*STAR-IME is seeking a Senior Scientist to lead development and optimization of hybrid bonding technologies for next‑gen semiconductor, photonics, AI, and HPC applications in Singapore.

The role emphasizes Cu/SiO₂ hybrid bonding, wafer/chip bonding, reliability assessment, and advanced materials characterization, with collaboration across researchers, industry partners, and customers to advance heterogeneous integration platforms.

Qualifications

• PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Mechanical Engineering, or related disciplines.
• Minimum 8 years of hands‑on experience in hybrid bonding, wafer bonding, or advanced packaging process development.
• Experience in heterogeneous integration, silicon photonics, or advanced packaging technologies is highly preferred.
• Demonstrated experience in process integration and DOE methodologies.
• Experience working with industry partners and equipment vendors.

Responsibilities

• Develop and optimize hybrid bonding processes for semiconductor and photonic applications.
• Lead process integration, characterization, and reliability evaluation activities.
• Perform defect analysis, root cause investigation, and yield improvement initiatives.
• Collaborate with customers, partners, and cross-functional teams on advanced packaging and heterogeneous integration projects.
• Support project execution, technical reporting, technology transfer, and team mentoring.

Skills

Hybrid bonding

Wafer bonding

Process integration

DOE methods

Reliability evaluation

Team mentoring

Education

PhD in Materials Science/Engineering

Tools

Characterization instruments

Semiconductor equipment

Job description

A*STAR-IME is seeking a highly motivated Senior Scientist to join our Advanced Packaging and Heterogeneous Integration team. The successful candidate will lead the development and optimization of hybrid bonding technologies for next-generation semiconductor, photonics, AI, and high-performance computing (HPC) applications.

The role focuses on Cu/SiO₂ hybrid bonding, wafer-level or chip level bonding processes, reliability assessment, and advanced materials characterization. The candidate will work closely with research scientists, industry partners, equipment vendors, and customers to develop innovative solutions for future heterogeneous integration platforms. This position offers opportunities to drive strategic R&D programs and contribute to cutting-edge advanced packaging technologies.

Key Responsibilities

• Develop and optimize hybrid bonding processes for semiconductor and photonic applications.
• Lead process integration, characterization, and reliability evaluation activities.
• Perform defect analysis, root cause investigation, and yield improvement initiatives.
• Collaborate with customers, partners, and cross-functional teams on advanced packaging and heterogeneous integration projects.
• Support project execution, technical reporting, technology transfer, and team mentoring.

Requirements

• PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Mechanical Engineering, or related disciplines.
• Minimum 8 years of hands‑on experience in hybrid bonding, wafer bonding, or advanced packaging process development.
• Experience in heterogeneous integration, silicon photonics, or advanced packaging technologies is highly preferred.
• Demonstrated experience in process integration and DOE methodologies.
• Experience working with industry partners and equipment vendors.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.