[50004213-RSE3A] Senior Scientist I, Process Modules

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

A*STAR-IME in Singapore seeks a highly motivated Senior Scientist to lead development and optimization of hybrid bonding technologies for advanced packaging and heterogeneous integration.

You will focus on Cu/SiO₂ hybrid bonding, wafer- or chip-scale bonding, reliability studies, and materials characterization, collaborating with researchers, industry partners and customers to drive next‑gen integration platforms.

Qualifications

• PhD in Materials Science, Electrical/ Chemical/ Physics or related field.
• Minimum 3 years hands-on experience in hybrid bonding or wafer bonding.
• Experience in heterogeneous integration or silicon photonics preferred.
• DOE methodologies and process integration experience.

Responsibilities

• Develop and optimize hybrid bonding processes for semiconductor and photonic applications.
• Lead process integration, characterization, and reliability evaluation activities.
• Perform defect analysis, root cause investigation, and yield improvement.
• Collaborate with customers, partners, and cross-functional teams on advanced packaging.
• Support project execution, technical reporting, technology transfer, and mentoring.

Skills

Hybrid bonding

Process integration

DOE methodologies

Materials characterization

Si photonics

Education

PhD in Materials Science, Electrical Eng, Chemical Eng, Physics, or related

Job description

Long Description

Position Title: Senior Scientist for Hybrid Bonding

A*STAR-IME is seeking a highly motivated Senior Scientist to join our Advanced Packaging and Heterogeneous Integration team. The successful candidate will lead the development and optimization of hybrid bonding technologies for next-generation semiconductor, photonics, AI, and high-performance computing (HPC) applications.

The role focuses on Cu/SiO₂ hybrid bonding, wafer-level or chip level bonding processes, reliability assessment, and advanced materials characterization. The candidate will work closely with research scientists, industry partners, equipment vendors, and customers to develop innovative solutions for future heterogeneous integration platforms. This position offers opportunities to drive strategic R&D programs and contribute to cutting-edge advanced packaging technologies.

Key Responsibilities

• Develop and optimize hybrid bonding processes for semiconductor and photonic applications.
• Lead process integration, characterization, and reliability evaluation activities.
• Perform defect analysis, root cause investigation, and yield improvement initiatives.
• Collaborate with customers, partners, and cross-functional teams on advanced packaging and heterogeneous integration projects.
• Support project execution, technical reporting, technology transfer, and team mentoring.

Requirements

• PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Mechanical Engineering, or related disciplines.
• Minimum 3 years of hands-on experience in hybrid bonding, wafer bonding, or advanced packaging process development.
• Experience in heterogeneous integration, silicon photonics, or advanced packaging technologies is highly preferred.
• Demonstrated experience in process integration and DOE methodologies.
• Experience working with industry partners and equipment vendors.