Scientist (Heterogeneous Integration), IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 40,000 - 80,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research in Singapore is seeking a Scientist/Senior Scientist for the Heterogeneous Integration Department. This pivotal role involves advancing hybrid bonding processes for 2.5D and 3D applications, alongside conducting reliability characterisation, leading projects, and mentoring talent. Candidates should hold a PhD in a relevant field and possess experience in microelectronic device integration. Strong analytical skills and a collaborative spirit are essential for success in this innovative research environment.

Qualifications

• PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, or Electronics.
• 0 to 5 years of experience in microelectronics and 2.5D/3D heterogeneous integration.
• Strong knowledge of hybrid bonding methods and reliability characterisation.

Responsibilities

• Collaborate on technology roadmaps and process capability requirements.
• Lead projects and mentor less experienced colleagues.
• Research advanced packaging technology and optimise bonding processes.
• Conduct engineering experiments for process characterisation.

Skills

Analytical and problem-solving skills

Collaboration in research-oriented environments

Proficiency in data analysis

Communication abilities

Education

PhD in Materials Science and Engineering or related field

Tools

Hybrid bonding equipment technologies

Job description

Overview

The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a Scientist/Senior Scientist to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterisation.

Key Responsibilities

• Collaborate with senior staff, process integrators, and external partners to address technology roadmaps, process capability requirements, and business challenges.
• Lead high-impact projects with manageable risks and mentor less experienced colleagues.
• Conceive and plan projects involving new materials, advanced process integration approaches, and innovative concepts.
• Research and develop advanced packaging technology such as flip-chip and hybrid bonding techniques for 2.5D and 3D IC applications.
• Investigate and refine wafer bonding processes for interposer fabrication, inter-dielectric gap fill, and alignment accuracy, addressing factors such as warpage, bonding strength, and yield.
• Optimise die bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
• Conduct engineering experiments for process characterisation to drive quality and yield improvements.
• Perform reliability characterisation of hybrid-bonded packages to ensure robustness and long-term performance.
• Act as a subject matter expert (SME) for internal and external stakeholders, providing guidance and expertise.
• Inspire and mentor talent in semiconductor technology, contributing to workforce development in the field.
• Work with minimal supervision and be a team player.

Qualifications and Skills

• Educational Background: PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
• Experience: 0 to 5 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogeneous integration applications.
• Technical Expertise: knowledge in hybrid bonding or flip chip bonding is a plus.
• Knowledge: Strong knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterisation is preferable.
• Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.
• Excellent written and verbal communication abilities.
• Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
• Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.
• Proven ability to troubleshoot and resolve process-related challenges.