Research Engineer /Senior Research Engineer - Process Integrator / Hybrid Bonding/ HI

A*STAR - Agency for Science, Technology and Research; Singapore; Sur place; SGD 60 000 - 90 000; Plein temps

Résumé du poste

The Institute of Microelectronics (IME), part of A*STAR, in Singapore is seeking a Research Engineer or Senior Research Engineer to advance hybrid bonding and 2.5D/3D packaging. You will develop fabs-ready techniques and perform electrical and reliability characterization in a dynamic research team.

Ideal candidates hold a relevant engineering degree with 1–6 years of microelectronics experience, plus hands-on flip chip bonding.

Qualifications

• Bachelor’s degree in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, ECE or related field.
• 1–6 years of experience in microelectronic devices and 2.5D/3D heterogenous integration.
• Hands-on flip chip bonding experience preferred.
• Knowledge of hybrid bonding equipment technologies and reliability characterization is advantageous.
• Strong written and verbal communication and teamwork abilities.

Responsabilités

• Research and develop advanced fine-pitch flip-chip and hybrid bonding techniques for chip-to-wafer and wafer-to-wafer bonding.
• Interposer and Hybrid Bond pad fabrication for flip chip and hybrid bonding applications.
• Optimize bonding processes with low-temperature organic/inorganic materials, surface prep, and methods.
• Conduct engineering experiments for process characterization to improve quality and yield.
• Perform reliability characterization of bonded packages to ensure robustness and long-term performance.
• Lead capability development projects and mentor less experienced colleagues.
• Collaborate with senior staff and principal investigators to develop process capability.
• Inspire and mentor talent in semiconductor technology, contributing to workforce development.

Connaissances

Data analysis

Experiment design

Analytical skills

Team collaboration

Formation

Bachelor’s degree in relevant field

Outils

Flip chip bonding equipment

Description du poste

Job Description

The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Research Engineer or Senior Research Engineer to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.

Job Description

The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Research Engineer or Senior Research Engineer to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.

Key Responsibilities

• Research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements.
• Interposer and Hybrid Bond pad fabrication for Flip Chip and Hybrid bonding applications
• Optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
• Conduct engineering experiments for process characterization to drive quality and yield improvements.
• Perform reliability characterization of flip-chip or hybrid-bonded packages to ensure robustness and long-term performance.
• Lead capability development projects with manageable risks and mentor less experienced colleagues.
• Collaborate with senior staff and principal investigators to develop process capability and new.
• Inspire and mentor talent in semiconductor technology, contributing to workforce development in the field.
  
  

Qualifications And Skills

Candidates should meet the following criteria:

• Educational Background: Bachelors in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
• Experience: 1 to 6 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogenous integration applications.
• Technical Expertise: Hands-on experience in flip chip bonding is preferable
• Knowledge: Knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterization is preferable, but not mandatory.
• Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.
• Excellent written and verbal communication abilities.
• Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
• Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.
  
  

What We Offer

• The opportunity to work on cutting-edge research in advanced packaging and heterogeneous integration.
• A collaborative and interdisciplinary work environment.
• Access to state-of-the-art facilities and resources.