Senior Scientist I — Hybrid Bonding & Heterogeneous Integration

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 150,000 - 230,000; Full time

Job summary

A*STAR-IME is seeking a Senior Scientist to lead development and optimization of hybrid bonding technologies for next‑gen semiconductor, photonics, AI, and HPC applications in Singapore.

The role emphasizes Cu/SiO₂ hybrid bonding, wafer/chip bonding, reliability assessment, and advanced materials characterization, with collaboration across researchers, industry partners, and customers to advance heterogeneous integration platforms.

Qualifications

• PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Mechanical Engineering, or related disciplines.
• Minimum 8 years of hands‑on experience in hybrid bonding, wafer bonding, or advanced packaging process development.
• Experience in heterogeneous integration, silicon photonics, or advanced packaging technologies is highly preferred.
• Demonstrated experience in process integration and DOE methodologies.
• Experience working with industry partners and equipment vendors.

Responsibilities

• Develop and optimize hybrid bonding processes for semiconductor and photonic applications.
• Lead process integration, characterization, and reliability evaluation activities.
• Perform defect analysis, root cause investigation, and yield improvement initiatives.
• Collaborate with customers, partners, and cross-functional teams on advanced packaging and heterogeneous integration projects.
• Support project execution, technical reporting, technology transfer, and team mentoring.

Skills

Hybrid bonding

Wafer bonding

Process integration

DOE methods

Reliability evaluation

Team mentoring

Education

PhD in Materials Science/Engineering

Tools

Characterization instruments

Semiconductor equipment

Job description

A*STAR-IME is seeking a Senior Scientist to lead development and optimization of hybrid bonding technologies for next‑gen semiconductor, photonics, AI, and HPC applications in Singapore.

The role emphasizes Cu/SiO₂ hybrid bonding, wafer/chip bonding, reliability assessment, and advanced materials characterization, with collaboration across researchers, industry partners, and customers to advance heterogeneous integration platforms.