Senior Scientist, Hybrid Bonding & Advanced Packaging

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

A*STAR-IME in Singapore seeks a highly motivated Senior Scientist to lead development and optimization of hybrid bonding technologies for advanced packaging and heterogeneous integration.

You will focus on Cu/SiO₂ hybrid bonding, wafer- or chip-scale bonding, reliability studies, and materials characterization, collaborating with researchers, industry partners and customers to drive next‑gen integration platforms.

Qualifications

• PhD in Materials Science, Electrical/ Chemical/ Physics or related field.
• Minimum 3 years hands-on experience in hybrid bonding or wafer bonding.
• Experience in heterogeneous integration or silicon photonics preferred.
• DOE methodologies and process integration experience.

Responsibilities

• Develop and optimize hybrid bonding processes for semiconductor and photonic applications.
• Lead process integration, characterization, and reliability evaluation activities.
• Perform defect analysis, root cause investigation, and yield improvement.
• Collaborate with customers, partners, and cross-functional teams on advanced packaging.
• Support project execution, technical reporting, technology transfer, and mentoring.

Skills

Hybrid bonding

Process integration

DOE methodologies

Materials characterization

Si photonics

Education

PhD in Materials Science, Electrical Eng, Chemical Eng, Physics, or related

Job description

A*STAR-IME in Singapore seeks a highly motivated Senior Scientist to lead development and optimization of hybrid bonding technologies for advanced packaging and heterogeneous integration.

You will focus on Cu/SiO₂ hybrid bonding, wafer- or chip-scale bonding, reliability studies, and materials characterization, collaborating with researchers, industry partners and customers to drive next‑gen integration platforms.