Principal Scientist I, Process Modules, APM, IME(2966)

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 110,000 - 170,000; Full time

Job summary

A*STAR RESEARCH ENTITIES in Singapore seeks a Research Scientist to advance temporary wafer bonding and debonding (TBDB) technologies for next-generation semiconductor packaging. You will join a multidisciplinary team to enable 3D ICs and wafer-level integration, driving research toward robust manufacturing solutions.

The role requires hands-on process development in cleanrooms, DOE design, data analysis, and close collaboration with design, equipment, reliability, and external partners to

Qualifications

• Ph.D. in a relevant discipline with at least 8 years of experience.
• Hands-on semiconductor process development in a cleanroom environment.
• Experience in temporary bonding, wafer bonding, advanced packaging, thin-wafer processing, or related modules; fresh Ph.D. graduates welcome.
• Strong analytical and problem-solving skills with experience in DOE and data analysis.
• Self-motivated team player with excellent communication and teamwork for innovative semiconductor technologies.

Responsibilities

• Develop and optimize temporary wafer bonding and debonding processes for advanced packaging.
• Design and execute DOE to improve process capability, yield, and reliability.
• Develop solutions for thin-wafer handling, layer transfer, debonding, cleaning, and warpage control.
• Investigate process challenges through root-cause analysis and implement corrective actions.
• Collaborate with design, integration, equipment, and reliability teams to develop robust solutions.
• Collaborate with vendors to evaluate and qualify new bonding materials, carrier systems, and equipment.
• Perform wafer characterization using advanced metrology and failure analysis techniques.
• Analyse process data, establish process control methods, and document technical results.
• Contribute to technology innovation through patents, publications, and collaboration with partners.

Skills

Analytical skills

Problem solving

Team player

Communication skills

Education

Ph.D. in relevant field

Job description

Temporary Wafer Bonding & Debonding (R&D)

We are seeking a passionate and innovative Research Scientist to join our multidisciplinary R&D team to develop temporary wafer bonding and debonding (TBDB) technologies for next-generation semiconductor packaging. This is an exciting opportunity to work on enabling technologies for 3D ICs, chiplets, heterogeneous integration, and wafer-level packaging, transforming research ideas into robust manufacturing solutions.

Key Responsibilities

• Develop and optimize temporary wafer bonding and debonding processes for advanced semiconductor packaging.
• Design and execute DOE to improve process capability, yield, and reliability.
• Develop solutions for thin-wafer handling, layer transfer, debonding, cleaning, and warpage control.
• Investigate process challenges through systematic root-cause analysis and implement corrective actions.
• Collaborate with design, integration, equipment, and reliability teams to develop robust process solutions.
• Collaborate with vendor to evaluate and qualify new bonding materials, carrier systems, and equipment.
• Perform wafer characterization using advanced metrology and failure analysis techniques.
• Analyse process data, establish process control methods, and document technical results.
• Contribute to technology innovation through patents, publications, and collaboration with internal and external partners.

Qualifications

• Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related discipline. At least 8 years of relevant experience.
• Hands-on experience in semiconductor process development within a cleanroom environment.
• Experience in temporary bonding, wafer bonding, advanced packaging, thin-wafer processing, semiconductor assembly, or related process modules is preferred. Fresh Ph.D. graduates with strong research interest are welcome to apply.
• Strong analytical and problem-solving skills with experience in DOE and statistical data analysis.
• Self-motivated team player with excellent communication and teamwork skills with a passion for developing innovative semiconductor technologies.