Senior Research Fellow - 2.5D/3D Packaging & Hybrid Bonding

National University of Singapore; Singapore; Presencial; SGD 120.000 - 180.000; Jornada completa

Descripción de la vacante

The National University of Singapore’s ECE Department is seeking a Senior Research Fellow to lead and contribute to wafer processing modules and advanced packaging programs. The role involves driving 2.5D/3D and heterogeneous integration initiatives, collaborating with tool vendors, academic researchers, and industrial partners to push the boundaries of packaging technology.

The successful candidate will spearhead research on CoW/WoW bonding, Cu interconnect integration, and related process

Formación

• Ph.D. or equivalent degree in Electrical, Electronics, Mechanical, Chemical Engineering, Physics, Material Science or its equivalent from a reputable University/Institute is preferred.
• 15+ years of industrial R&D, or advanced research and development experience in wafer foundry process and semiconductor packaging.
• Proficiency in data analysis and interpretation using statistical tools and software packages.
• Excellent communication skills and the ability to work effectively in a collaborative research environment.
• Motivated and possesses effective communication skills including writing and presenting.

Responsabilidades

• Addressing key issues of the SOTA technologies with focus on wafer processing and advanced packaging to improve process capability, integration performance, reliability and scalability.
• CoW and WoW Hybrid Bonding Technology Development and key process modules required to enable advanced 2.5D/3D and heterogeneous integration.
• Next Generations Heterogeneous Integration Technology Development for 2.5D/3D packaging, chiplet integration, and emerging system integration technologies.
• Contribute to invention disclosures, patent filings, and technology commercialization activities; publish in high-impact journals and present at conferences.
• Lead a critical module team to enable leadership system integration technology for 2.5D and 3D/hybrid bonding systems; assume project ownership.

Conocimientos

Data analysis

Communication

Presentations

Educación

PhD or equivalent

Herramientas

Statistical tools

Descripción del empleo

The National University of Singapore’s ECE Department is seeking a Senior Research Fellow to lead and contribute to wafer processing modules and advanced packaging programs. The role involves driving 2.5D/3D and heterogeneous integration initiatives, collaborating with tool vendors, academic researchers, and industrial partners to push the boundaries of packaging technology.

The successful candidate will spearhead research on CoW/WoW bonding, Cu interconnect integration, and related process