Thermo-Mechanical Simulation Fellow, Advanced Packaging

National University of Singapore; Singapore; Vor Ort; SGD 60.000 - 90.000; Vollzeit

Zusammenfassung

The National University of Singapore’s ECE Department seeks a Research Fellow to drive thermo-mechanical and thermal simulation research for next-generation semiconductor packaging, including 2.5D/3D integration and Silicon Photonics.

The role focuses on predictive simulation of thermo-mechanical behavior and reliability, collaborating with industry partners to advance packaging technologies for AI and HPC applications.

Qualifikationen

• PhD in a relevant engineering/physics field is preferred.
• 3+ years of industrial R&D or advanced research in semiconductor packaging, thermal engineering, or reliability.

Aufgaben

• Develop and execute finite element simulations (FEA) to evaluate thermal and mechanical behavior of advanced semiconductor packages.
• Model thermo-mechanical stresses from CTE mismatch, warpage, and assembly processes.
• Establish predictive models for package reliability and correlate with experimental data.
• Publish findings and generate IP through patents and publications.

Kenntnisse

Solid mechanics

Fracture mechanics

Heat transfer

Finite element analysis

Python

MATLAB

Analytical thinking

Communication skills

Ausbildung

PhD in Electrical, Electronics, Mechanical, Chemical Engineering, Computational Engineering, Applied Physics, Materials Science or equivalent

Tools

ANSYS Mechanical

ANSYS Icepak

COMSOL Multiphysics

Abaqus

Jobbeschreibung

The National University of Singapore’s ECE Department seeks a Research Fellow to drive thermo-mechanical and thermal simulation research for next-generation semiconductor packaging, including 2.5D/3D integration and Silicon Photonics.

The role focuses on predictive simulation of thermo-mechanical behavior and reliability, collaborating with industry partners to advance packaging technologies for AI and HPC applications.