Research Fellow: Low-Temp Cu-Cu Bonding for 3D Packaging

Nanyang Technological University; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

NTU Singapore's School of Electrical and Electronic Engineering invites a Research Fellow to advance low-temperature Cu/dielectric hybrid bonding for fine-pitch 3D integration. You will develop and validate a new flow, select materials, and demonstrate reliability to enable manufacturable solutions.

The role requires a PhD in a relevant field, hands-on cleanroom experience with Cu interconnect and wafer bonding, and strong data analysis.

Qualifications

• PhD in Materials/Microelectronics/EEE or related.
• Hands-on semiconductor process development in cleanroom.
• Cu interconnect/wafer or hybrid bonding experience.
• Lithography/etch/CMP/plasma/anneal experience.
• Characterization: optical/profilometry, SEM/TEM, XPS/AFM, electrical probing.
• DoE and statistics; Python/ Matlab a plus.
• Strong documentation and clear communication in English.
• Process integration and optimization; root-cause/failure analysis.
• Reliability mindset; thermal and electrical stress testing.
• Collaboration with tool vendors and industry partners.

Responsibilities

• Develop and run a Cu–Cu hybrid bonding flow for fine-pitch 3D integration.
• Optimize process windows (pressure/temperature/anneal/surface activation) to minimize contact resistance and voids; maintain cleanroom/tool best practices.
• Characterize materials and interfaces using optical/profilometry, SEM/TEM, surface chemistry, and electrical IV; translate data into process improvements.
• Validate reliability and scalability via thermal cycling/HTS/electrical stress on test vehicles; build prototype stacks to evidence manufacturability.
• Report and collaborate: produce clear technical reports/presentations, coordinate with partners, and maintain rigorous documentation.

Education

PhD in Materials/Microelectronics/EEE or related

Tools

Cu interconnect

Hybrid bonding

Process development

Cleanroom

Characterization

DoE stats

Python Matlab

SEM TEM

XPS AFM

Communication

Collaboration

Job description

NTU Singapore's School of Electrical and Electronic Engineering invites a Research Fellow to advance low-temperature Cu/dielectric hybrid bonding for fine-pitch 3D integration. You will develop and validate a new flow, select materials, and demonstrate reliability to enable manufacturable solutions.

The role requires a PhD in a relevant field, hands-on cleanroom experience with Cu interconnect and wafer bonding, and strong data analysis.