Senior Thermo-Mechanical Simulation Research Fellow

NATIONAL UNIVERSITY OF SINGAPORE; Singapore; Presencial; SGD 120 000 - 180 000; Tempo integral

Resumo da oferta

The ECE Department at NATIONAL UNIVERSITY OF SINGAPORE is seeking a Senior Research Fellow. We require an experienced Thermo-Mechanical and Thermal Simulation Researcher to drive modeling and simulation for next-generation semiconductor packaging, including 2.5D, 3D, chiplet, and heterogeneous integration.

The role involves leading a module team, developing FE models, and correlating results with reliability data.

Qualificações

• PhD preferred in engineering or physics; exceptional candidates with a Master’s degree and strong industry background may be considered.
• 3+ years of industrial R&D or advanced research in semiconductor packaging, thermal engineering, reliability, or related fields.
• Experience in thermo-mechanical and thermal simulation of advanced electronic packages; publications are a plus.

Responsabilidades

• Develop and execute FE/multiphysics simulations to evaluate thermal/mechanical behavior of advanced packages.
• Establish predictive reliability models and correlate with experimental data.
• Lead research on 2.5D/3D packaging, chiplet integration, and heterogeneous integration.
• Drive design recommendations based on simulation insights and contribute to IP and publications.
• Collaborate with academia, industry partners, and government-sponsored institutes.

Conhecimentos

Thermo-mechanical modeling

Finite element analysis

Reliability engineering

AI/HP packaging knowledge

Multiphysics modeling

Scripting (Python, MATLAB)

Formação académica

PhD in Engineering/Physics or equivalent

Master plus substantial industry experience

Ferramentas

ANSYS Mechanical

ANSYS Icepak

COMSOL Multiphysics

Abaqus

Python

MATLAB

Descrição da oferta de emprego

The ECE Department at NATIONAL UNIVERSITY OF SINGAPORE is seeking a Senior Research Fellow. We require an experienced Thermo-Mechanical and Thermal Simulation Researcher to drive modeling and simulation for next-generation semiconductor packaging, including 2.5D, 3D, chiplet, and heterogeneous integration.

The role involves leading a module team, developing FE models, and correlating results with reliability data.