Senior Research Fellow: 2.5D/3D Packaging & Bonding Lead

NATIONAL UNIVERSITY OF SINGAPORE; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

The National University of Singapore's ECE Department seeks a Senior Research Fellow to lead wafer process modules for advanced patterning, including lithography, etching, and Cu interconnect integration. The role focuses on 2.5D/3D, chiplet and heterogeneous integration while collaborating with process tool vendors, researchers and industrial partners.

The successful candidate will spearhead innovative process solutions, contribute to IP, publish in leading journals, and assume primary

Qualifications

• Ph.D. or equivalent degree in Electrical, Electronics, Mechanical, Chemical Engineering, Physics, Materials Science or related field from a reputable university.
• 15+ years of industrial R&D or advanced research experience in wafer foundry processes and semiconductor packaging.
• Experience in Silicon photonics integration including CPO and FAU.
• Strong data analysis and interpretation using statistical tools and software packages.
• Excellent communication and collaboration in multidisciplinary research environments.
• Open to Fixed Term Contract.

Responsibilities

• Address key issues of SOTA technologies in wafer processing and advanced packaging to improve capability, integration, reliability and scalability.
• Lead CoW and WoW hybrid bonding technology development and related process modules for 2.5D/3D integration.
• Develop next-generation heterogeneous integration technologies supporting 2.5D/3D packaging and chiplet concepts.
• Contribute to invention disclosures, IP filings and tech commercialization; publish in high-impact venues.
• Provide leadership to a module team and manage deliverables for leadership system integration.

Skills

Data analysis

Communication

Leadership

Collaboration

Education

PhD or equivalent

Tools

Statistical software

Job description

The National University of Singapore's ECE Department seeks a Senior Research Fellow to lead wafer process modules for advanced patterning, including lithography, etching, and Cu interconnect integration. The role focuses on 2.5D/3D, chiplet and heterogeneous integration while collaborating with process tool vendors, researchers and industrial partners.

The successful candidate will spearhead innovative process solutions, contribute to IP, publish in leading journals, and assume primary