Senior Interconnect & 3D Packaging Research Engineer

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

The Institute of Microelectronics (IME) at A*STAR in Singapore is seeking a motivated Research Engineer / Senior Research Engineer to develop and optimize advanced assembly processes such as die attach, wire bonding, and flip chip technologies for next-generation semiconductor packaging.

You will collaborate with cross-disciplinary teams to deliver robust process solutions, feasibility studies, and IP development supporting industry partnerships and customer engagements.

Qualifications

• Experience in semiconductor assembly processes including die attach and bonding.
• Hands-on approach to process development in a multidisciplinary team.
• Strong analytical and problem-solving skills.

Responsibilities

• Develop and integrate advanced die attach, wire bonding, and flip chip assembly processes.
• Evaluate materials, interconnects, and equipment to improve performance and yield.
• Design experiments (DOE) to optimize process parameters and recipes.

Skills

Semiconductor assembly

Die attach

Wire bonding

Flip chip bonding

Thermocompression bonding

Advanced packaging

Education

Bachelor's or Master's in Electrical Engineering / Materials Science / Mechanical Engineering / Physics / Manufacturing Engineering

Job description

The Institute of Microelectronics (IME) at A*STAR in Singapore is seeking a motivated Research Engineer / Senior Research Engineer to develop and optimize advanced assembly processes such as die attach, wire bonding, and flip chip technologies for next-generation semiconductor packaging.

You will collaborate with cross-disciplinary teams to deliver robust process solutions, feasibility studies, and IP development supporting industry partnerships and customer engagements.