Senior Research Fellow — BS-PDN & Advanced Packaging

National University of Singapore

Singapore

Sur place

SGD 150 000 - 180 000

Plein temps

Il y a 5 jours
Soyez parmi les premiers à postuler
Générateur de candidature

Une candidature complète en une minute — un CV et une lettre de motivation personnalisés, prêts à envoyer.

Passez les filtres ATS

Résumé du poste

National University of Singapore (NUS) seeks a Senior Research Fellow to lead BS-PDN research and develop optimization methods for advanced packaging, including 3DIC and chiplet-based architectures. The role involves modeling, data-driven approaches, and close industry-academic collaboration.

The successful candidate will mentor students and junior researchers, drive project roadmaps, and contribute to proposals, publications, and IP activities within the Electrical and Computer Engineering

Qualifications

  • PhD in a relevant engineering or science field is preferred, or equivalent experience.
  • Experience in microelectronic research, metrology, electrical testing, and data analysis is advantageous.
  • Expanded project management experience with ownership of deliverables.
  • Strong communication skills for collaboration and dissemination.

Responsabilités

  • Lead BS-PDN research and System-Technology Co-Optimization for advanced logic, chiplet-based, and 3DIC systems.
  • Define strategic R&D roadmap and drive BS-PDN and advanced packaging initiatives; develop multi-physics workflows.
  • Mentor junior researchers and manage project resources, budgets, and industry collaborations.
  • Publish findings in journals and conferences; contribute to invention disclosures and tech transfer.

Connaissances

Data analysis
Communication
Independent work
Leadership

Formation

PhD in Electrical/Electronic/Mechanical/Chemical Engineering or related field
Experience in microelectronic research and data analysis

Description du poste

National University of Singapore (NUS) seeks a Senior Research Fellow to lead BS-PDN research and develop optimization methods for advanced packaging, including 3DIC and chiplet-based architectures. The role involves modeling, data-driven approaches, and close industry-academic collaboration.

The successful candidate will mentor students and junior researchers, drive project roadmaps, and contribute to proposals, publications, and IP activities within the Electrical and Computer Engineering

Obtenez votre examen gratuit et confidentiel de votre CV.

ou faites glisser et déposez votre fichier ici.

Similar jobs

Postes similaires à comparer

Senior Research Fellow [BS-PDN]
Senior Research Fellow [BS-PDN]

National University of Singapore • Singapore

Sur place
SGD 150 000 - 180 000
Senior R&D Engineer - Semiconductor Packaging & Process
Senior R&D Engineer - Semiconductor Packaging & Process

BLESSED AGAPE CONNECTIONS PTE. LTD. • Singapore

Sur place
SGD 70 000 - 110 000
Senior Research Engineer: 2.5D/3D Packaging & Chiplet ICs
Senior Research Engineer: 2.5D/3D Packaging & Chiplet ICs

A*STAR - Agency for Science, Technology and Research • Singapore

Sur place
SGD 70 000 - 100 000
Access to state-of-the-art facilities
Opportunity for professional growth
Collaborative work environment
Research Fellow: Advanced IC Design & Power Management
Research Fellow: Advanced IC Design & Power Management

NATIONAL UNIVERSITY OF SINGAPORE • Singapore

Sur place
SGD 70 000 - 100 000
Research Fellow: Nanoelectronics & Emerging Devices
Research Fellow: Nanoelectronics & Emerging Devices

National University of Singapore • Singapore

Sur place
SGD 70 000 - 95 000
Senior Advanced Packaging R&D Engineer (5nm/3nm)
Senior Advanced Packaging R&D Engineer (5nm/3nm)

AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED • Singapore

Sur place
SGD 120 000 - 190 000
Senior Interconnect & 3D Packaging Research Engineer
Senior Interconnect & 3D Packaging Research Engineer

A*STAR - Agency for Science, Technology and Research • Singapore

Sur place
SGD 90 000 - 130 000
Lead Research Fellow - High-Precision 3D Printing
Lead Research Fellow - High-Precision 3D Printing

National University of Singapore • Singapore

Sur place
SGD 65 000 - 90 000
Research Engineer: Photonic Packaging & Optical Interfaces
Research Engineer: Photonic Packaging & Optical Interfaces

National University of Singapore • Singapore

Sur place
SGD 50 000 - 75 000
Research Fellow - Quantum Photonics & SNSPD Tech
Research Fellow - Quantum Photonics & SNSPD Tech

Nanyang Technological University Singapore • Singapore

Sur place
SGD 70 000 - 100 000