Senior Research Engineer: 2.5D/3D Packaging & Interposer

A*STAR International; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

The Institute of Microelectronics (IME) invites a Senior/Lead Research Engineer to advance cutting-edge packaging technology, including fan-out, 2.5D interposers, and 3D stacking for heterogeneous integration. You will collaborate with design, process, and external partners to define design rules, develop test vehicles, and drive qualification through pilot to production.

Ideal candidates hold a Bachelor's or Master's in a relevant field and have 5–10 years in semiconductor backend integration,

Qualifications

• Semiconductor experience with Cu backend integration.
• Expertise in flip-chip, FOWLP, 2.5D/3D, TSVs, and fusion/hybrid bonding.
• Experience with design rules, PDKs, and process integration.
• Strong communication and ability to work in diverse teams.

Responsibilities

• Develop packaging platforms: fan-out, 2.5D interposer, 3D stacking.
• Lead internal/external projects with new materials and tests.
• Coordinate with design, process, and yield teams; manage schedules.
• Mentor students and engage with partners and universities.

Skills

Cu backend integration

2.5D packaging

FOWLP

3D stacking

design rules & PDK

DOE & SPC

cross-functional teamwork

leadership/mentoring

Education

Bachelor's or Master's in related field

Tools

JMP

Minitab

Job description

The Institute of Microelectronics (IME) invites a Senior/Lead Research Engineer to advance cutting-edge packaging technology, including fan-out, 2.5D interposers, and 3D stacking for heterogeneous integration. You will collaborate with design, process, and external partners to define design rules, develop test vehicles, and drive qualification through pilot to production.

Ideal candidates hold a Bachelor's or Master's in a relevant field and have 5–10 years in semiconductor backend integration,