Lead Research Engineer – FOWLP & 2.5D Packaging

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

The Advanced Packaging Department at IME, under A*STAR Research Entities, seeks a Lead Research Engineer to drive fan-out wafer level packaging integration for AI applications. You will shape process integration, collaborate with industry and academia, mentor peers, and contribute to disruptive packaging technologies.

Ideal candidates have 5–10 years in semiconductor process integration, hands-on lithography/plating/etching, and strong analytical skills.

Qualifications

• Bachelors/Masters in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or related field.
• 5–10 years of experience in semiconductor devices fabrication process integration.
• Hands-on experience in lithography, plating, etching and RDL/bumping integration.
• Knowledge of wafer-level fabrication processes and advanced packaging technologies.
• Strong analytical and problem-solving skills with data interpretation and DOE design.
• Excellent written and verbal communication abilities.
• Ability to work collaboratively in a research-oriented environment with OEMs and customers.
• Experience in heterogeneous integration, FOWLP technologies and advanced packaging processes.

Responsibilities

• Process integration development for high density multi-chip FOWLP for AI/HPC, Co-packaged Optics, Power devices, etc.
• Develop capabilities such as fine pitch RDL, micro bumping, multi-layer RDL, polymer damascene.
• Establish RDL-first and mold-first FOWLP integration flows to meet partner requirements.
• Plan short loops and work with process module team to evaluate processes and materials.
• Collaborate with industry partners and multidisciplinary team members to execute tasks.
• Conduct experiments for process characterization to drive quality and yield improvements.
• Coordinate and support engineering builds using developed packaging processes and integration.
• Lead industry and internal capability development projects with mentoring.
• Inspire and mentor talent; publish findings at journals and conferences.

Skills

Strong analytical & problem solving

Data analysis & interpretation

Design of experiments

Communications (written & verbal)

Education

Bachelor's/Master's in Materials Science & Eng, Mechanical/Chemical Eng, Electronics, ECE or related field

Job description

The Advanced Packaging Department at IME, under A*STAR Research Entities, seeks a Lead Research Engineer to drive fan-out wafer level packaging integration for AI applications. You will shape process integration, collaborate with industry and academia, mentor peers, and contribute to disruptive packaging technologies.

Ideal candidates have 5–10 years in semiconductor process integration, hands-on lithography/plating/etching, and strong analytical skills.