Senior Research Engineer II, fan-in/fan-out wafer-level pkg, 2.5D interposers, Adv Pkg, IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research invites applications for a Senior Research Engineer / Research Engineer in its Advanced Packaging Programme in Singapore. The role focuses on prototyping and small-volume manufacturing on state-of-the-art packaging platforms, including FOWLP, 2.5D interposers, and W2W/C2W 3D integration.

You will develop manufacturing plans, supervise process flows, monitor yields, and collaborate with researchers and industry partners to translate concepts

Qualifications

• Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Microelectronics, or related discipline.
• 2-3 years of experience in semiconductor manufacturing, advanced packaging, process integration, or related fields.
• Hands-on experience with prototyping or low-volume manufacturing environments.
• Knowledge of 2.5D/3D IC integration and related packaging technologies is advantageous.
• Experience with MES, SPC and quality systems is a plus.

Responsibilities

• Plan, coordinate, and execute prototype and small-volume manufacturing runs using advanced packaging technologies.
• Develop manufacturing plans, process flows, and work instructions to meet requirements.
• Monitor production activities, troubleshoot issues, and implement corrective actions.
• Coordinate logistics, scheduling, and resources to ensure on-time delivery.
• Perform process monitoring, yield analysis, and root-cause investigations.
• Support customer prototype builds and qualification activities.
• Drive continuous improvement to enhance efficiency, quality, and operational excellence.
• Maintain manufacturing documentation and ensure compliance with safety and procedures.

Skills

Analytical skills

Troubleshooting

Data analysis

Communication

Project coordination

Team collaboration

Stakeholder management

Education

Bachelor's or Master's in Electrical Engineering / Materials Science / Mechanical Engineering / Microelectronics

Tools

MES

Process qualification methodologies

Statistical Process Control (SPC)

Job description

Senior Research Engineer / Research Engineer, Advanced Packaging

IME's Advanced Packaging Programme is looking for a passionate Engineer to drive prototyping and small-volume manufacturing activities using state-of-the-art packaging platforms such as fan-in/fan-out wafer-level packaging, 2.5D interposers, and W2W/C2W 3D integration. The successful candidate will play a key role in developing innovative package architectures, advancing technology demonstrations, and working closely with researchers and industry collaborators to translate concepts into functional prototypes. The role focuses on delivering high-quality products, ensuring process stability, coordinating manufacturing operations.

Job Responsibilities

• Plan, coordinate, and execute prototype and small-volume manufacturing runs using advanced packaging technologies, including Fan-In/Fan-Out Wafer Level Packaging (FOWLP), 2.5D interposers, and W2W/C2W 3D integration.
• Develop manufacturing plans, process flows, and work instructions to meet customer and project requirements.
• Monitor production activities, troubleshoot process issues, and implement corrective actions to improve yield, quality, and cycle time.
• Work closely with process, equipment, and quality engineers to ensure stable and repeatable manufacturing performance.
• Coordinate wafer and material logistics, production scheduling, and resource allocation to ensure on-time delivery.
• Perform process monitoring, yield analysis, failure analysis, and root-cause investigations.
• Support customer prototype builds, engineering lots, and qualification activities.
• Drive continuous improvement initiatives to enhance manufacturing efficiency, quality, and operational excellence.
• Maintain manufacturing documentation, including process specifications, manufacturing reports, and quality records.
• Ensure compliance with safety, quality, and operational procedures.

Job Requirements

• Bachelor's, Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Microelectronics, or a related discipline.
• 2-3 years of experience in semiconductor manufacturing, advanced packaging, process integration, or related fields.
• Fresh graduates with a strong interest in semiconductor packaging and manufacturing are also encouraged to apply.
• Knowledge of semiconductor packaging processes such as lithography, plating, RDL formation, wafer thinning, bonding, molding, and assembly is advantageous.
• Hands-on experience in prototype builds or low-volume manufacturing environments.
• Knowledge in 2.5D/3D IC integration, hybrid bonding, chiplet packaging, or heterogeneous integration technologies; is an advantage
• Experience with manufacturing execution systems (MES), quality management systems, and process qualification methodologies
• Familiarity with statistical process control (SPC), yield analysis, and problem-solving methodologies.
• Strong analytical, troubleshooting, and data analysis skills.
• Ability to work effectively in a multidisciplinary team environment and interact with internal and external stakeholders.
• Excellent communication and project coordination skills.