Senior Research Engineer (Interconnect & Assembly Integration), APM, IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

The Institute of Microelectronics (IME) at A*STAR in Singapore is seeking a motivated Research Engineer / Senior Research Engineer to develop and optimize advanced assembly processes such as die attach, wire bonding, and flip chip technologies for next-generation semiconductor packaging.

You will collaborate with cross-disciplinary teams to deliver robust process solutions, feasibility studies, and IP development supporting industry partnerships and customer engagements.

Qualifications

• Experience in semiconductor assembly processes including die attach and bonding.
• Hands-on approach to process development in a multidisciplinary team.
• Strong analytical and problem-solving skills.

Responsibilities

• Develop and integrate advanced die attach, wire bonding, and flip chip assembly processes.
• Evaluate materials, interconnects, and equipment to improve performance and yield.
• Design experiments (DOE) to optimize process parameters and recipes.

Skills

Semiconductor assembly

Die attach

Wire bonding

Flip chip bonding

Thermocompression bonding

Advanced packaging

Education

Bachelor's or Master's in Electrical Engineering / Materials Science / Mechanical Engineering / Physics / Manufacturing Engineering

Job description

Long Description

About Us:

The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced packaging technologies for next-generation heterogeneous integration. Our research focuses on pioneering platforms such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D packaging, chiplet integration, co-packaged optics, and advanced power module packaging. At IME, you will have access to state-of-the-art semiconductor packaging facilities and play a key role in developing innovative assembly solutions for future electronic systems.

Position Overview

We are seeking a highly motivated Research Engineer / Senior Research Engineer to develop, optimize, and integrate advanced assembly processes focusing on die attach, wire bonding, and flip chip technologies. The successful candidate will contribute to cutting-edge semiconductor packaging programs, enabling next-generation high-performance, high-reliability package solutions for diverse applications.

Project Collaboration

• Work closely with multidisciplinary teams including process integration, reliability, materials, design, and characterization engineers to deliver project objectives.
• Support customer engagements, joint development projects, and industry collaborations through technical discussions and experimental execution.

Key Responsibilities

• Develop and integrate advanced die attach, wire bonding, and flip chip assembly processes FOWLP, 2.5D/3D integration, chiplet packaging, photonics, and power electronics applications.
• Evaluate emerging assembly materials, interconnect technologies, and equipment capabilities to enhance package performance, reliability, and manufacturability.
• Conduct feasibility studies, to support new process development and platform expansion.

Establish Robust Process Solutions.

• Design and execute Design of Experiments (DOE) to optimize process parameters, material selection, and assembly recipes.
• Develop process control methodologies, characterization plans, and defect reduction strategies to improve yield, reliability, and throughput.

Intellectual Property and Technical Contributions.

• Generate detailed engineering reports, technical publications, and presentations to communicate research findings.
• Contribute to the development of intellectual property (IP), patents, and technical know-how in advanced semiconductor assembly technologies.

Customer and Market Engagement

• Collaborate with internal and external stakeholders to understand future packaging trends and customer requirements.
• Develop assembly capabilities that address emerging industry needs in heterogeneous integration, AI computing, photonics, and advanced power applications.

Requirements

• Bachelor's, or Master's in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Manufacturing Engineering, or a related discipline.
• Relevant experience in semiconductor assembly processes, including die attach, wire bonding, flip chip bonding, thermocompression bonding, or advanced packaging development.
• Strong analytical and problem-solving skills with a hands-on approach to process development.

Ability to work effectively in a multidisciplinary research and development environment.