Senior Quantum 3D Packaging & Integration Architect

Applied Materials, Inc.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Applied Materials is seeking a Process Engineer to design and optimize manufacturing processes for display and semiconductor technologies. You will collect data, analyze, troubleshoot, and collaborate with vendors and R&D teams to implement new quantum packaging solutions.

You will work with 3D integration, advanced packaging, and metrology experts to develop materials, processes, and structures for quantum devices, while maintaining safety and quality standards across projects.

Qualifications

• PhD, Master’s, or Bachelor’s degree in Materials Science, Electrical Engineering, Physics, Microelectronics, or a related field.
• 5+ years of experience in advanced packaging, 3D integration, heterogeneous integration, or semiconductor process development.
• Strong knowledge of wafer-level packaging, hybrid bonding, TSV, chiplets, flip‑chip, and related packaging technologies.
• Hands-on experience in semiconductor fabrication, process integration, materials characterization, and metrology.
• Experience with DOE, data analysis, process optimization, and root cause analysis.
• Familiarity with quantum devices, superconducting technologies, photonics, or cryogenic systems is a strong plus.
• Strong problem‑solving, technical communication, and cross‑functional collaboration skills.
• Ability to work effectively with customers, startups, universities, and multidisciplinary R&D teams.

Responsibilities

• Create 3D integration and packaging solutions for different platforms and quantum structures
• Work with advanced packaging, process, hardware, and metrology team to develop new materials, processes, and structures for quantum devices
• Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines
• Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues
• Generate internal and external documentation for products, presentations and technical reports
• Design and conduct experiment, measure material and device properties and interpret data
• Keep up to date with the latest advancements in 3D integration, quantum information, and related fields to continually implement new technologies, enhance approaches, and develop methodologies
• Collaborate with customers, start‑ups, or universities to identify key problems and develop enabling solutions

Skills

5+ years experience

3D integration

Advanced packaging

Data analysis

DOE / root cause analysis

Technical communication

Cross-functional collaboration

Education

PhD / Master’s / Bachelor’s in Materials Science or related field

Tools

Wafer-level packaging

Hybrid bonding

TSV

Chiplets

Flip-chip

Metrology

DOE data tools

Job description

Applied Materials is seeking a Process Engineer to design and optimize manufacturing processes for display and semiconductor technologies. You will collect data, analyze, troubleshoot, and collaborate with vendors and R&D teams to implement new quantum packaging solutions.

You will work with 3D integration, advanced packaging, and metrology experts to develop materials, processes, and structures for quantum devices, while maintaining safety and quality standards across projects.