Quantum Packaging Engineer - Heterogeneous 3D Qubit Systems

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 120,000 - 170,000; Full time

Job summary

The incumbent will be part of heterogeneous integration group focused on development of the quantum packaging technology platforms to integrate qubit and control chip on superconductivity interposer.

He/she will work with cross functional team to design and simulate circuits, develop packaging rules, and lead grant proposals while engaging industry partners for next generation platforms.

Qualifications

• Master/PhD in quantum computing or related field.
• 4–5 years’ experience in superconducting circuits design and simulation for scalable quantum processors.
• Experience measuring loss and dielectric constants at cryogenic temperatures.
• Effective communication, industry awareness and critical thinking.

Responsibilities

• Design and simulation of superconducting circuits for salable quantum processors in 3D flip-chip architecture.
• Explore and develop superconducting nanowire base photo detectors.
• Design and layout of circuits components of a superconducting qubit.
• Process development for quantum packaging. Develop design rules and PDK for quantum packaging technologies.
• Provide quantum packaging solutions to meet the system requirements based on simulation results.
• Prepare competitive grant research proposals and lead execution of these proposals.
• Engage industry partners to align and develop the building blocks required for next generations quantum packaging platforms.

Skills

Quantum computing

Communication

Critical thinking

Education

Master/PhD in quantum computing

Electrical and Computer Engineering

Materials science

Job description

The incumbent will be part of heterogeneous integration group focused on development of the quantum packaging technology platforms to integrate qubit and control chip on superconductivity interposer.

He/she will work with cross functional team to design and simulate circuits, develop packaging rules, and lead grant proposals while engaging industry partners for next generation platforms.