Senior Quantum 3D Integration & Packaging Engineer

WhiteCrow Research Pvt. Ltd.; Singapore; On-site; SGD 180,000 - 230,000; Full time

Job summary

WhiteCrow Research Pvt. Ltd. is partnering with a global leader in materials engineering solutions to recruit a Senior Quantum 3D Integration and Packaging Engineer in Singapore.

You will design 3D integration and packaging solutions for quantum structures, collaborating with packaging, process, hardware, and metrology teams to advance technology. The ideal candidate holds a PhD/Master’s/Bachelor’s in a related field with 5+ years in advanced packaging and deep knowledge of wafer-level

Qualifications

• PhD, Master’s or Bachelor’s degree in Materials Science, Electrical Engineering, Physics, Microelectronics, or related field.
• Minimum 5 years in advanced packaging, 3D/heterogeneous integration, or semiconductor process development.
• Strong knowledge of wafer-level packaging, hybrid bonding, TSV, chiplets, flip-chip and related packaging technologies.
• Hands-on semiconductor fabrication, process integration, materials characterization, and metrology.
• Experience with DOE, data analysis, process optimization, and root cause analysis.
• Familiarity with quantum devices, superconducting technologies, photonics, or cryogenic systems is a strong plus.

Responsibilities

• Creating 3D integration and packaging solutions for different platforms and quantum structures.
• Working with advanced packaging, process, hardware, and metrology teams to develop new materials, processes, and structures for quantum devices.
• Designing, collecting data, analyzing and compiling reports on a variety of difficult process engineering experiments, within safety guidelines.
• Troubleshooting a variety of complex problems, performing Root Cause Analysis and resolving a variety of difficult process engineering issues.
• Generating internal and external documentation for products, presentations and technical reports.
• Designing and conducting experiments, measuring material and device properties and interpret data.
• Keeping up to date with the latest advancements in 3D integration, quantum information, and related fields to continually implement new technologies, enhance approaches, and develop methodologies.
• Collaborating with customers, startups, or universities to identify key problems and develop enabling solutions.

Skills

Problem-solving

Technical communication

Cross-functional collaboration

Education

PhD/Master's/Bachelor's in relevant field

Tools

Wafer-level packaging

Hybrid bonding

TSV

Chiplets

Flip-chip

Metrology

Job description

WhiteCrow Research Pvt. Ltd. is partnering with a global leader in materials engineering solutions to recruit a Senior Quantum 3D Integration and Packaging Engineer in Singapore.

You will design 3D integration and packaging solutions for quantum structures, collaborating with packaging, process, hardware, and metrology teams to advance technology. The ideal candidate holds a PhD/Master’s/Bachelor’s in a related field with 5+ years in advanced packaging and deep knowledge of wafer-level