Advanced Assembly Engineer (2.5-3D)

Universal Quantum Ltd.; Singapore; On-site; SGD 150,000 - 210,000; Full time

Job summary

Universal Quantum Ltd. is hiring an Advanced Assembly Engineer to develop and design advanced assembly methods for quantum computers, focusing on 2.5D/3D integration.

You will contribute to the creation of assembly flows for diverse quantum devices and work closely with cross-functional teams. The role emphasizes innovation, reliability, and collaboration with external vendors to push the boundaries of semiconductor assembly in quantum technology, ensuring robust performance across operating

Qualifications

• Experience with wafer-level 2.5D/3D packaging and semiconductor assembly.
• DFM/DFT expertise to improve design for manufacturability.
• Knowledge of common package technologies and materials.
• Familiarity with CAD tools and thermo-mechanical simulation.
• FEM for thermal, electrical, and mechanical analyses.
• Ability to resolve assembly reliability issues across wide temperature ranges.
• Understanding semiconductor assembly manufacturing and failure mechanisms.
• Strong engineering problem-solving skills with solid physics fundamentals.
• PhD or Master’s degree in relevant fields.

Responsibilities

• Develop assembly flows for various quantum computing devices
• Drive methodology, innovation, and productivity improvements in assembly development internally and with external vendors
• Initiate assembly concepts and lead advanced IC assembly development leveraging 2.5D and 3D assembly technologies
• Select and manage external partners to ensure successful execution

Skills

Semiconductor assembly

2.5D/3D packaging

DFM/DFT

CAD tools

Thermo-mechanical simulation

FEM

Reliability analysis

Physics fundamentals

Temperature range handling

Education

PhD or Master’s in mechanical engineering, materials science, physics, packaging, or micro/nanofabrication

Tools

CAD tools

Thermo-mechanical simulation

Job description

At Universal Quantum, we aim to make the world a better place by developing a new computer technology. Together, we are creating truly impactful quantum computers. Our machines will be capable of solving problems until now considered impossible, with applications ranging across a broad range of industries, including healthcare, materials and aerospace.

We are looking to hire an AdvancedAssemblyEngineer (2.5-3D)to develop, design,advanced assembly methods forquantum computers.

WhatYou’llAccomplish

• Developassembly flows for various quantum computing devices
• Drive methodology, innovation, and productivity improvements inassemblydevelopment internally and with external vendors
• Initiateassemblyconcepts and lead advanced ICassemblydevelopment leveraging 2.5D and 3Dassemblytechnologies
• Select and manage external partners to ensure successful execution

The 3 Most Critical AttributesWe’llUse to Compare Candidates

1. Deep Technical Expertise in semiconductorassembly, including 2.5D/3D integration and advanced ICassemblytechnologies
2. Problem-Solving Ability with strong engineering fundamentals and experience resolving complex reliability and performance challenges
3. Innovation and Leadership in driving new methodologies, collaborating with vendors, and improving design flows and productivity

Must-have Skills

• Semiconductorassemblyexperience, including wafer-level 2.5D/3D packaging
• Design for Excellence (DFM, DFT) experience
• Knowledge ofcommon package technologies and materials
• Familiarity with CAD tools and thermo-mechanical simulation.
• Finite Element Modeling (FEM) for thermal, electrical, and mechanical simulations
• Ability to resolveassemblyreliability issues across wide temperature ranges
• Understandingsemiconductor assembly manufacturing and packaging/assemblyfailure mechanisms
• Strong engineering problem-solving skills with solid physics fundamentals
• PhD/master's degreein mechanical engineering, material science, physics, packaging, or micro/nanofabrication
  

Nice-to-have Skills

• Development of technology PDKs
• Knowledge of Through-Silicon Via (TSV), silicon processing, and thin-film techniques
• Electro-mechanical testing at cryogenic temperatures
• High-voltage/power package qualification experience
• Process engineering background