Senior Quantum 3D Integration and Packaging Engineer

Applied Materials, Inc.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Applied Materials is seeking a Process Engineer to design and optimize manufacturing processes for display and semiconductor technologies. You will collect data, analyze, troubleshoot, and collaborate with vendors and R&D teams to implement new quantum packaging solutions.

You will work with 3D integration, advanced packaging, and metrology experts to develop materials, processes, and structures for quantum devices, while maintaining safety and quality standards across projects.

Qualifications

• PhD, Master’s, or Bachelor’s degree in Materials Science, Electrical Engineering, Physics, Microelectronics, or a related field.
• 5+ years of experience in advanced packaging, 3D integration, heterogeneous integration, or semiconductor process development.
• Strong knowledge of wafer-level packaging, hybrid bonding, TSV, chiplets, flip‑chip, and related packaging technologies.
• Hands-on experience in semiconductor fabrication, process integration, materials characterization, and metrology.
• Experience with DOE, data analysis, process optimization, and root cause analysis.
• Familiarity with quantum devices, superconducting technologies, photonics, or cryogenic systems is a strong plus.
• Strong problem‑solving, technical communication, and cross‑functional collaboration skills.
• Ability to work effectively with customers, startups, universities, and multidisciplinary R&D teams.

Responsibilities

• Create 3D integration and packaging solutions for different platforms and quantum structures
• Work with advanced packaging, process, hardware, and metrology team to develop new materials, processes, and structures for quantum devices
• Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines
• Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues
• Generate internal and external documentation for products, presentations and technical reports
• Design and conduct experiment, measure material and device properties and interpret data
• Keep up to date with the latest advancements in 3D integration, quantum information, and related fields to continually implement new technologies, enhance approaches, and develop methodologies
• Collaborate with customers, start‑ups, or universities to identify key problems and develop enabling solutions

Skills

5+ years experience

3D integration

Advanced packaging

Data analysis

DOE / root cause analysis

Technical communication

Cross-functional collaboration

Education

PhD / Master’s / Bachelor’s in Materials Science or related field

Tools

Wafer-level packaging

Hybrid bonding

TSV

Chiplets

Flip-chip

Metrology

DOE data tools

Job description

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next‑generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

What We Offer

Location: Singapore,SGP You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Process Engineer

As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. You'll also measure film properties, generate technical documentation, and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers, and become familiar with implementing new technologies and products. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state‑of‑the‑art research and development projects. At Applied’s CTO group, we focus on solid‑state solutions for quantum technology, i.e. superconducting qubits and optical quantum computing. Our primary objective is to collaborate with system companies and universities to develop quantum devices with significantly lower error rates compared to current standards. Our approach centers on harnessing state of the art materials engineering and semiconductor processing, as well as our expertise in advanced (metasurface‑based) optics to enhance device performance. To achieve this goal, we're seeking a passionate technologist with strong semiconductor and 3D integration background to develop advanced packaging solutions for emerging markets and new technology inflection on quantum information.

Responsibilities

• Create 3D integration and packaging solutions for different platforms and quantum structures
• Work with advanced packaging, process, hardware, and metrology team to develop new materials, processes, and structures for quantum devices
• Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines
• Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues
• Generate internal and external documentation for products, presentations and technical reports
• Design and conduct experiment, measure material and device properties and interpret data
• Keep up to date with the latest advancements in 3D integration, quantum information, and related fields to continually implement new technologies, enhance approaches, and develop methodologies
• Collaborate with customers, start‑ups, or universities to identify key problems and develop enabling solutions

Requirements

• PhD, Master’s, or Bachelor’s degree in Materials Science, Electrical Engineering, Physics, Microelectronics, or a related field.
• 5+ years of experience in advanced packaging, 3D integration, heterogeneous integration, or semiconductor process development.
• Strong knowledge of wafer‑level packaging, hybrid bonding, TSV, chiplets, flip‑chip, and related packaging technologies.
• Hands‑on experience in semiconductor fabrication, process integration, materials characterization, and metrology.
• Experience with DOE, data analysis, process optimization, and root cause analysis.
• Familiarity with quantum devices, superconducting technologies, photonics, or cryogenic systems is a strong plus.
• Strong problem‑solving, technical communication, and cross‑functional collaboration skills.
• Ability to work effectively with customers, startups, universities, and multidisciplinary R&D teams.

Work Location

Science Park II (Moving to Tampines office starting May 2027)

Additional Information

• Time Type: Full time
• Employee Type: Assignee / Regular
• Travel: Relocation Eligible: No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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