Scientist, Heterogenous Integration, Adv Pkg, IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research seeks a Scientist/Senior Scientist to advance quantum packaging platforms for integrating qubits and control chips on a superconducting interposer. The role involves cross-functional collaboration to design, simulate, and develop 3D flip-chip quantum processors, photodetectors, and related packaging rules.

The candidate will lead design-rule development, contribute to grant proposals, and partner with industry to mature building blocks for

Qualifications

• Master/PhD in quantum computing; Electrical and Computer Engineering; Materials science area
• 4 to 5 years’ experience in superconducting circuits design and simulation for scalable quantum processors
• Experience measuring loss and dielectric constants at cryogenic temperatures
• Effective communication, industry awareness, and critical thinking skills.

Responsibilities

• Design and simulation of superconducting circuits for salable quantum processors in 3D flip-chip architecture.
• Explore and develop superconducting nanowire base photo detectors.
• Design and layout of circuits components of a superconducting qubit.
• Process development for quantum packaging. Develop design rules and PDK for quantum packaging technologies.
• Provide quantum packaging solutions to meet the system requirements based on simulation results.
• Prepare competitive grant research proposals and lead execution of these proposals.
• Engage industry partners to align and develop the building blocks required for next generations quantum packaging platforms.

Skills

Quantum computing

Superconducting circuits

Circuit simulation

Cryogenic measurements

Communication skills

Critical thinking

Education

Master's or PhD in quantum computing / Electrical & Computer Engineering / Materials science

Tools

3D flip-chip design

PDK development

Job description

Short Description

Scientist/Senior scientist will be part of heterogeneous integration group focused on development of the quantum packaging technology platforms to integrate qubit and control chip on superconductivity interposer.

He/she will work with cross functional team to

• Design and simulation of superconducting circuits for salable quantum processors in 3D flip-chip architecture.
• Explore and develop superconducting nanowire base photo detectors.
• Design and layout of circuits components of a superconducting qubit.
• Process development for quantum packaging. Develop design rules and PDK for quantum packaging technologies.
• Provide quantum packaging solutions to meet the system requirements based on simulation results.
• Prepare competitive grant research proposals and lead execution of these proposals.
• Engage industry partners to align and develop the building blocks required for next generations quantum packaging platforms.

He/she will work with cross functional team to

• Design and simulation of superconducting circuits for salable quantum processors in 3D flip-chip architecture.
• Explore and develop superconducting nanowire base photo detectors.
• Design and layout of circuits components of a superconducting qubit.
• Process development for quantum packaging. Develop design rules and PDK for quantum packaging technologies.
• Provide quantum packaging solutions to meet the system requirements based on simulation results.
• Prepare competitive grant research proposals and lead execution of these proposals.
• Engage industry partners to align and develop the building blocks required for next generations quantum packaging platforms.

Job Requirements

• Master/PhD in quantum computing; Electrical and Computer Engineering; Material science area
• 4 to 5 years’ experience in superconducting circuits design and simulation for scalable quantum processors. Deep understanding of 3D quantum package
• Working experience on measuring loss and dielectric constants of materials at cryogenic temperatures
• Effective communication, industry awareness, and critical thinking skills.