Advanced Packaging Metrology Engineer: Real-Time Defect Analysis

Micron Technology

Singapore

On-site

SGD 90,000 - 130,000

Full time

3 days ago

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Job summary

Micron Technology Singapore is seeking an Advanced Packaging Metrology‑RDA Engineer to develop metrology recipes for high‑performance memory packaging. You will optimize inspection methods, perform in‑line characterization, and analyze data with tools like Power BI to drive continuous improvement.

A strong background in semiconductor processing and statistics is required, with AI‑enabled optimization encouraged.

Qualifications

PhD with ≥2 years or Master’s with ≥5 years or Bachelor’s with ≥7 years in relevant fields.
Experience in semiconductor process or equipment engineering, wafer bonding, plating, warpage control and packaging.
Strong data analytics and experience with SPC, DOE, defect analysis and dashboarding.

Responsibilities

Develop and optimize metrology recipes for semiconductor processes.
Establish inspection methodologies and best-known methods for metrology.
Utilize Power BI to summarize and report metrology status and project progress.
Own metrology tools and ensure they meet performance indicators and quality standards.
Collaborate with multiple teams to integrate manufacturing processes for performance and quality.
Apply AI-enabled tools to improve efficiency and outcomes.