Staff Engineer, Real-Time Defect Metrology for Packaging

Micron Technology, Inc; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. is seeking an Advanced Packaging Metrology-RDA Engineer to join the Advanced Packaging Technology Development team in Singapore. You will develop and optimize metrology recipes for semiconductor processes and drive yield improvements through data-driven insight.

You will collaborate with cross-functional teams to deploy AI-assisted tools, establish SPC controls, and validate metrology methods while ensuring production quality and alignment with the technology roadmap.

Qualifications

• PhD/Master/Bachelor in a relevant field with process or equipment experience.

Responsibilities

• Develop and optimize metrology recipes for semiconductor processes.
• Ensure recipes are accurate and efficient for production needs.
• Develop and execute strategies for process monitoring, sampling, and CIP.
• Establish inspection methodologies and BKM for metrology processes.
• Perform in-line characterization and validation of metrology recipes.
• Utilize data analysis tools to summarize metrology progress and reports.
• Own metrology tools, ensuring performance and quality standards.
• Drive OCAP/ SPC charts and readiness for manufacturing.
• Collaborate with Package Integration, PWF/Assembly Eng, Front End, and Quality teams.
• Apply AI-assisted tools to improve efficiency and outcomes.

Skills

Python

R

SQL

Visual Basic

E3

FDC

RMS

Data analytics

DOE

Dashboarding

Wafer tooling

Education

PhD in Electrical Engineering

Master’s degree in Electrical Engineering

Bachelor’s degree in Electrical Engineering

Tools

Power BI

Job description

Micron Technology, Inc. is seeking an Advanced Packaging Metrology-RDA Engineer to join the Advanced Packaging Technology Development team in Singapore. You will develop and optimize metrology recipes for semiconductor processes and drive yield improvements through data-driven insight.

You will collaborate with cross-functional teams to deploy AI-assisted tools, establish SPC controls, and validate metrology methods while ensuring production quality and alignment with the technology roadmap.