Staff Engineer, Real-Time Defect Metrology for Packaging

Micron Technology, Inc

Singapore

Presencial

SGD 120.000 - 180.000

Jornada completa

14 días+

Consigue una respuesta de este empleador

Tu currículum y tu carta de presentación, adaptados exactamente a lo que buscan contratar.

Supera los filtros ATS

Descripción de la vacante

Micron Technology, Inc. is seeking an Advanced Packaging Metrology-RDA Engineer to join the Advanced Packaging Technology Development team in Singapore. You will develop and optimize metrology recipes for semiconductor processes and drive yield improvements through data-driven insight.

You will collaborate with cross-functional teams to deploy AI-assisted tools, establish SPC controls, and validate metrology methods while ensuring production quality and alignment with the technology roadmap.

Formación

  • PhD/Master/Bachelor in a relevant field with process or equipment experience.

Responsabilidades

  • Develop and optimize metrology recipes for semiconductor processes.
  • Ensure recipes are accurate and efficient for production needs.
  • Develop and execute strategies for process monitoring, sampling, and CIP.
  • Establish inspection methodologies and BKM for metrology processes.
  • Perform in-line characterization and validation of metrology recipes.
  • Utilize data analysis tools to summarize metrology progress and reports.
  • Own metrology tools, ensuring performance and quality standards.
  • Drive OCAP/ SPC charts and readiness for manufacturing.
  • Collaborate with Package Integration, PWF/Assembly Eng, Front End, and Quality teams.
  • Apply AI-assisted tools to improve efficiency and outcomes.

Conocimientos

Python
R
SQL
Visual Basic
E3
FDC
RMS
Data analytics
DOE
Dashboarding
Wafer tooling

Educación

PhD in Electrical Engineering
Master’s degree in Electrical Engineering
Bachelor’s degree in Electrical Engineering

Herramientas

Power BI

Descripción del empleo

Micron Technology, Inc. is seeking an Advanced Packaging Metrology-RDA Engineer to join the Advanced Packaging Technology Development team in Singapore. You will develop and optimize metrology recipes for semiconductor processes and drive yield improvements through data-driven insight.

You will collaborate with cross-functional teams to deploy AI-assisted tools, establish SPC controls, and validate metrology methods while ensuring production quality and alignment with the technology roadmap.

Consigue la evaluación confidencial y gratuita de tu currículum.

o arrastra y suelta tu archivo aquí

Similar jobs

Puestos de trabajo similares que vale la pena comparar

Advanced Packaging Metrology Engineer: Real-Time Defect Analysis
Advanced Packaging Metrology Engineer: Real-Time Defect Analysis

Micron Technology • Singapore

Presencial
SGD 90.000 - 130.000
Senior Engineer — Real-Time Metrology for Packaging
Senior Engineer — Real-Time Metrology for Packaging

Micron Technology, Inc. • Singapore

Presencial
SGD 120.000 - 180.000
Senior Engineer, Metrology & MRDA Data Systems
Senior Engineer, Metrology & MRDA Data Systems

Micron Technology, Inc. • Singapore

Presencial
SGD 90.000 - 130.000
Principal Engineer, Real-Time Metrology & Defect AI
Principal Engineer, Real-Time Metrology & Defect AI

Micron Technology, Inc. • Singapore

Presencial
SGD 120.000 - 180.000
Advanced Packaging Metrology Engineer: AI-Driven Yield
Advanced Packaging Metrology Engineer: AI-Driven Yield

Micron Technology, Inc. • Singapore

Presencial
SGD 120.000 - 190.000
Senior Packaging Metrology & RDA Engineer (AI-Driven)
Senior Packaging Metrology & RDA Engineer (AI-Driven)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. • Singapore

Presencial
SGD 120.000 - 190.000
Lead Metrology & AI-Driven Packaging Engineer
Lead Metrology & AI-Driven Packaging Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD • Singapore

Presencial
SGD 180.000 - 260.000
Real-time Defect Analysis Engineer – NPI & Packaging Tools
Real-time Defect Analysis Engineer – NPI & Packaging Tools

Micron Technology, Inc. • Singapore

Presencial
SGD 70.000 - 100.000
Senior/Principal Metrology Engineer — Advanced Packaging (AI)
Senior/Principal Metrology Engineer — Advanced Packaging (AI)

Micron Technology, Inc. • Singapore

Presencial
SGD 150.000 - 230.000
Senior Engineer - Packaging Tech, Data Analytics & NPI
Senior Engineer - Packaging Tech, Data Analytics & NPI

Micron Technology, Inc. • Singapore

Presencial
SGD 120.000 - 180.000