Senior Engineer, Metrology & AI-Driven Packaging

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks an experienced professional to own inspection and metrology platforms across packaging development and manufacturing. You will lead technology roadmaps, data-driven improvements, and cross-functional collaboration to drive manufacturing excellence.

The role focuses on advancing defect detection, AI-enabled analytics, and scalable tool deployment, with emphasis on NPI readiness, supplier engagement, and global program leadership.

Qualifications

• Bachelor's degree in Engineering or equivalent.
• Deep understanding of semiconductor equipment performance, process integration, and manufacturing operations.
• Experience driving equipment qualifications, technology transfers, and ramp readiness.
• Strong supplier management and collaborator engagement skills.
• Demonstrated ability to influence technical strategy across multiple organizations and sites.
• Strong communication, problem-solving, and executive presentation skills.
• Ability to operate effectively in highly matrixed global organizations.
• Leveraging AI, analytics, and automation to drive manufacturing excellence and efficiency.

Responsibilities

• Manage advanced inspection and metrology platforms throughout package development and manufacturing.
• Develop technology roadmaps and capability strategies to meet future packaging requirements.
• Drive equipment lifecycle management, capacity planning, and technology insertion activities.
• Lead tool installation, qualification (TIQ), release, and production readiness activities.
• Establish equipment acceptance criteria, qualification methodologies, and deployment plans.
• Drive tool-to-tool matching and network standardization initiatives.
• Develop inspection solutions to detect, monitor, and reduce critical defect mechanisms.
• Set up defect metrics, observation methods, and continuous advancement plans.
• Manage MRDA data systems and engineering applications for Advanced and Conventional Packaging.
• Enable integration of inspection, metrology, manufacturing, and quality data for defect traceability.

Skills

Engineering leadership

Project management

Communication skills

Data analytics

AI/automation

Education

Bachelor's degree in Engineering

Job description

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks an experienced professional to own inspection and metrology platforms across packaging development and manufacturing. You will lead technology roadmaps, data-driven improvements, and cross-functional collaboration to drive manufacturing excellence.

The role focuses on advancing defect detection, AI-enabled analytics, and scalable tool deployment, with emphasis on NPI readiness, supplier engagement, and global program leadership.