Senior Panel-Level Packaging Engineer – Thin-Film Focus

applied materials south east asia pte. ltd.

Singapore

On-site

SGD 110,000 - 170,000

Full time

14 days+

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Job summary

Applied Materials is seeking an Advanced Packaging Integration Engineer to join the Advanced Packaging Disruptive Technology team. This role focuses on advanced packaging process integration, thin film deposition and etching techniques, and driving innovation across manufacturing processes.

The candidate will lead complex technology projects, collaborate with cross-functional teams, and contribute to patents and publications while delivering scalable solutions for high-end packaging applications.

Qualifications

Bachelor’s degree with 15 years of experience, Master’s degree with 10 years or PhD with 5 years in Electrical Engineering, Materials Science, Chemical Engineering, or related field.
Expertise in thin film deposition techniques and dielectric etch and panel packaging process integration.
Experience with fan-out panel-level packaging (FOPLP), substrate technology and wafer back-end.
Knowledge of industry standards in semiconductor packaging.
Strong understanding of semiconductor packaging technologies and process flows.
Ability to work in fast-paced environment and cleanroom.

Responsibilities

Define and implement process flows for panel-level packaging and advanced panel technologies.
Drive material selection and compatibility studies for large-format form factors.
Keeps abreast of new developments and publishes in ET conferences and journals.
Develop innovative solutions and contribute to patents and awards.
Conceive and implement new technology and guide engineers in applying methods to complex systems.
Work with design, reliability, and materials teams to ensure manufacturability and performance.