Senior / Engineer, Process Engineering (Advanced Packaging)

ASM; Singapore; On-site; SGD 60,000 - 85,000; Full time

Job summary

ASM is looking for candidates to build foundational next-generation semiconductor technologies in Singapore. The role involves supporting the development and optimization of advanced packaging processes, conducting experiments, and collaborating with cross-functional teams. Candidates should have relevant degrees and experience in semiconductor processing or materials science. Strong analytical skills and the ability to work in a multicultural environment are essential.

Qualifications

• PhDs or Master's in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• Academic or internship experience in semiconductor processing.
• Familiarity with thin-film deposition techniques like ALD, CVD, or PECVD.

Responsibilities

• Support the development of semiconductor processes.
• Assist with planning and executing experiments.
• Collect and analyze experimental data to support process improvements.

Skills

Chemical Engineering

Materials Science

Electrical Engineering

Physics

Thin-film deposition

Problem-solving

Data analysis

Collaboration

Education

Ph.D. or Master's in relevant field

Bachelor's with strong research background

Tools

SEM

AFM

XRD

Ellipsometry

Job description

Job's mission

Build the foundation of nextgeneration semiconductor technologies.

What You Will Be Working On

• Support the development and optimization of semiconductor processes for advanced packaging applications, including thinfilm deposition (ALD, PECVD, PVD, ECP) and surface preparation
• Assist with planning and executing experiments, applying structured problem solving and basic DOE concepts
• Collect, analyze, and document experimental data to support process learning and improvement
• Develop new films or processes for emerging packaging applications like hybrid bonding and perform advanced materials characterization.
• Perform hands‑on work with process equipment under guidance, including basic troubleshooting and tool characterization
• Collaborate with cross‑functional teams such as equipment engineering, applications, and R&D to support process integration
• Contribute to technical documentation, reports, and internal knowledge sharing
• Learn and apply safe working practices in laboratory and cleanroom environments

What We Are Looking For

• Ph. Ds or Master's in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field. Bachelor's with strong research background can be considered.
• Academic, internship, or project experience in semiconductor processing, materials science, or microelectronics
• Familiarity with at least one thinfilm deposition or process technique (e.g., ALD, CVD, PECVD, PVD, electrochemical processes) through coursework or lab work
• Exposure to hybrid bonding concepts, surface preparation, or integration topics through academic projects
• Basic understanding of experimental methods, data analysis, or statistical concepts
• Exposure to materials or surface characterization techniques through university labs or projects (e.g., SEM, AFM, XRD, ellipsometry)
• Strong curiosity, learning mindset, and willingness to develop hands‑on technical skills
• Ability to communicate clearly and work effectively in a collaborative, multicultural environment

What Sets You Apart

• Internship, coop, or thesis experience related to semiconductor manufacturing or advanced packaging
• Experience writing technical reports or presenting project results
• Interest in working closely with complex equipment and understanding how processes translate to customer applications
• Motivation to grow into deeper technical ownership and future engineering leadership

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identity or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.