Principal Process Engineer - Advanced Packaging Innovator

ASM International; Singapore; On-site; SGD 180,000 - 280,000; Full time

Job summary

ASM International in Singapore is seeking a Principal / Senior Engineer in Process Engineering (Advanced Packaging) to lead advanced packaging process development, focusing on thin-film deposition and materials characterization.

You will design experiments (DOE/RSM), develop new films for W2W/D2W Hybrid bonding, mentor engineers, collaborate with customers, and travel up to 10% to support remote sites. Strong background in ALD, PECVD, PVD, XPS, XRD and related techniques is required.

Qualifications

• Minimum 10 years of combined education, research, and work experience in thin-film deposition and advanced packaging processes.
• Direct experience with D2W/W2W Hybrid bonding and surface preparation steps.
• Proficiency in materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry).
• Ability to manage complex process development projects including schedules, budgets, and personnel.

Responsibilities

• Research, develop, and optimize semiconductor processes focused on Advanced Packaging with depositions (ALD, PECVD, PVD, ECP) and surface preparation.
• Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze data.
• Develop new films or processes for emerging packaging applications and perform advanced materials characterization.
• Mentor Process Engineers and lead technical problem-solving sessions using Ishikawa diagrams.
• Collaborate with customers and marketing teams to define requirements and execute demonstrations.
• Troubleshoot equipment issues and ensure successful product transfer to customers.
• Draft technical papers, generate IP, and present findings to professional audiences.
• Travel up to 10% to support remote sites and customer engagements.

Skills

Thin-film deposition

Materials characterization

Project management

Communication skills

Education

Bachelor's, Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering or Physics

Master’s or PhD in related field

Tools

XPS

SIMS

RBS

AFM

XRR

XRD

TEM

SEM

Ellipsometry

Job description

ASM International in Singapore is seeking a Principal / Senior Engineer in Process Engineering (Advanced Packaging) to lead advanced packaging process development, focusing on thin-film deposition and materials characterization.

You will design experiments (DOE/RSM), develop new films for W2W/D2W Hybrid bonding, mentor engineers, collaborate with customers, and travel up to 10% to support remote sites. Strong background in ALD, PECVD, PVD, XPS, XRD and related techniques is required.