Senior /Research Engineer (PECVD Module for Advanced Packaging and Photonics) (APM/Thin Films), IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A research institute in Singapore is seeking a qualified candidate to develop and optimize Plasma-Enhanced Chemical Vapor Deposition (PECVD) processes for advanced packaging and photonics applications. The ideal candidate will have at least 3 years of experience in semiconductor thin film modules, strong communication skills, and hands-on experience with characterization techniques. Responsibilities include troubleshooting film properties and preparing technical reports for stakeholders.

Qualifications

• 3+ years direct experience in semiconductor thin film module, preferably in PECVD module.
• Hands-on experience with basic process characterization techniques is advantageous.
• Good understanding of thin film property characterization is desired.

Responsibilities

• Develop and optimize PECVD process for Advanced Packaging and Photonics applications.
• Characterize thin film properties and troubleshoot process-related issues.
• Prepare and deliver technical reports and presentations.

Skills

Thin film deposition techniques

Statistical process control (SPC)

Design of Experiments (DOE)

Interpersonal and communication skills

Education

Bachelors/Masters in Materials Science

Electrical Engineering

Chemical Engineering

Physics

Chemistry

Microelectronics

Tools

DRSEM

HRTEM

Ellipsometry

Job description

Job Description

• Develop and optimize Plasma-Enhanced Chemical Vapor Deposition (PECVD) process for Advanced Packaging and Photonics applications.
• Characterize thin film properties and troubleshoot process-related issues to ensure quality and performance.
• Serve as a subject matter expert, supporting integration teams with technical insights and recommendations.
• Collaborate with fab teams to implement and maintain statistical process control (SPC) for thin film modules.
• Prepare and deliver technical reports and presentations for both internal stakeholders and external customers.

Requirements

• Bachelors/Masters in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Chemistry, and Microelectronics, or related fields.
• 3+ years direct experience in semiconductor thin film module, preferably in PECVD module.
• Good understanding of thin film deposition techniques and thin film property characterization is desired.
• Hands‑on experience in Design of Experiments (DOE) methodologies, statistical root‑cause analysis, and problem‑solving methods is desired.
• Understanding of thin film tool hardware is advantageous.
• Hands‑on experience with basic process characterization techniques such as DRSEM, HRTEM and Ellipsometry is advantageous.
• Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.