Senior Packaging Engineer - MEMS/WLCSP | Equity & Bonus

SiTime Corp.

Singapore

On-site

SGD 60,000 - 90,000

Full time

4 days ago

Be an early applicant

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Benefits offered by this job

Quarterly bonus

Equity grants

Job summary

SiTime in Singapore is seeking a Packaging Process Engineer to develop, optimize and sustain advanced packaging processes (WLCSP) for bumping, RDL, underfill and dicing. You will drive process capability, quality and yield improvements while collaborating with R&D, design and manufacturing teams.

The role emphasizes hands-on execution, cross-functional NPI involvement, and ongoing technology qualification to support production roadmaps.

Qualifications

Develop, optimize, and characterize packaging processes for WLCSP technologies, including bumping, RDL formation, underfill, and dicing.
Perform root cause analysis and implement corrective actions using 8D methodology.
Collaborate with R&D, design, equipment, and manufacturing teams to ensure smooth transfer from development to high-volume manufacturing.
Lead or participate in cross-functional NPI and process-improvement projects.
Evaluate and qualify new materials, equipment, and processes to support roadmaps and production needs.
Stay updated with industry trends in packaging technologies.

Responsibilities

Develop, optimize, and characterize packaging processes for WLCSP technologies.
Perform root cause analysis and implement CAPA using 8D methodology.
Collaborate with cross-functional teams to enable transfer to high-volume manufacturing.
Lead or participate in NPI and process-improvement initiatives.
Define process specifications, control plans, and SOPs.
Provide technical support and training for operators and technicians.