Sr. Package Engineer

SiTime

Singapore

On-site

SGD 60,000 - 90,000

Full time

4 days ago
Be an early applicant

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Benefits offered by this job

Quarterly bonus
Equity grants

Job summary

SiTime in Singapore is seeking a Packaging Process Engineer to develop, optimize and sustain advanced packaging processes (WLCSP) for bumping, RDL, underfill and dicing. You will drive process capability, quality and yield improvements while collaborating with R&D, design and manufacturing teams.

The role emphasizes hands-on execution, cross-functional NPI involvement, and ongoing technology qualification to support production roadmaps.

Qualifications

  • Develop, optimize, and characterize packaging processes for WLCSP technologies, including bumping, RDL formation, underfill, and dicing.
  • Perform root cause analysis and implement corrective actions using 8D methodology.
  • Collaborate with R&D, design, equipment, and manufacturing teams to ensure smooth transfer from development to high-volume manufacturing.
  • Lead or participate in cross-functional NPI and process-improvement projects.
  • Evaluate and qualify new materials, equipment, and processes to support roadmaps and production needs.
  • Stay updated with industry trends in packaging technologies.

Responsibilities

  • Develop, optimize, and characterize packaging processes for WLCSP technologies.
  • Perform root cause analysis and implement CAPA using 8D methodology.
  • Collaborate with cross-functional teams to enable transfer to high-volume manufacturing.
  • Lead or participate in NPI and process-improvement initiatives.
  • Define process specifications, control plans, and SOPs.
  • Provide technical support and training for operators and technicians.

Skills

Bumping
RDL formation
Underfill
Dicing
Cp/Cpk
SPC
SOPs
NPI

Job description

About SiTime

SiTime is the Precision Timing company. Timing is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems in sync, but they struggle in harsher, more demanding environments. MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS timing powers over 400 applications, including high-growth ones in AI datacenters, automated driving, industrial and humanoid robots, wearables and IoT. Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. With more than 4 billion devices shipped, SiTime is changing the timing industry.

Job Summary

We are seeking a highly motivated and skilled Packaging Process Engineer to join SiTime in Singapore, focusing on Bumping, Flip-chip and Wafer-Level Chip Scale Packaging (WLCSP) technologies. In this role, you will be responsible for developing, optimizing, and sustaining advanced packaging processes to ensure high-quality and high-yield manufacturing. This is an excellent opportunity for a hands‑on engineer to make a significant impact on cutting‑edge semiconductor packaging technologies within a dynamic and innovative environment.

Responsibilities
Package Development
  • Develop, optimize, and characterize packaging processes for WLCSP technologies, including but not limited to bumping, re-distribution layer (RDL) formation, underfill, dicing...
  • Perform root cause analysis and implement corrective and preventive actions (8D methodology) for process‑related issues and defects.
  • Collaborate with R&D, design, equipment, and manufacturing teams to ensure seamless process transfer from development to high-volume manufacturing.
  • Lead or participate in cross‑functional teams for new product introduction (NPI) and process improvement projects.
  • Evaluate and qualify new materials, equipment, and processes to support technology roadmaps and production requirements.
  • Stay updated with the latest industry trends and advancements in packaging technologies.
Package Manufacture and Sustaining
  • Conduct process capability analysis (Cp/Cpk), implement statistical process control (SPC), and drive continuous improvement initiatives to enhance yield, quality, and cost‑efficiency.
  • Define and maintain process specifications, control plans, and standard operating procedures (SOPs).
  • Provide technical support and training for manufacturing operators and technicians.
Desired Characteristics & Attributes
Core Skills :
  • Make things more efficient: They should be able to improve how the packaging line works. This means reducing waste, getting more products out the door, and fixing issues that cause shutdowns.
  • Know their stuff: They need to understand different materials like plastic, glass, and cardboard, and how to work with a wide range of machines-from fillers and sealers to labelers.
  • Keep quality high: A great candidate is dedicated to safety and quality standards, following rules like Good Manufacturing Practices (GMP).
Personal Traits
  • Problem-solver: They can find and fix complex issues on their own. They're proactive and don't just wait for problems to get worse.
  • Detailed and thorough: They pay close attention to every detail to prevent errors that could lead to wasted products or costly mistakes.
  • Good communicator: They can work well with everyone on the team-from the factory floor crew to the R&D department. They can explain technical problems clearly to anyone.
Compensation Range

At SiTime , we believe great work deserves great rewards. We offer a comprehensive and highly competitive compensation package designed to attract top talent. In addition to base salary, this role is eligible for a quarterly bonus tied to the achievement of innovation goals-reflecting our commitment to recognizing meaningful impact. We also offer equity grants, providing a meaningful opportunity to share in the company's future growth and success.

Equal Employment Opportunity Statement

SiTime is committed to providing equal employment opportunities to all employees and applicants. Employment decisions are based on qualifications, merit, and business needs. We do not discriminate on the basis of any characteristic protected by applicable law.

Learn More about SiTime

Review the Get to Know SiTime section of our career page to explore our culture, values, and what makes us unique. Innovation on Top - Philosophies of Innovation with Rajesh Vashist Fabrication Knowledge - An Interview with Rajesh Vashist SiTime Corporation - YouTube

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Sr. Package Engineer Remote - Singapore
Sr. Package Engineer Remote - Singapore

SiTime Corp. • Singapore

Remote
SGD 70,000 - 110,000
Quarterly bonus
Equity grants
Senior Packaging Engineer - MEMS/WLCSP | Equity & Bonus
Senior Packaging Engineer - MEMS/WLCSP | Equity & Bonus

SiTime Corp. • Singapore

On-site
SGD 60,000 - 90,000
Quarterly bonus
Equity grants
Senior MEMS Packaging Engineer - Singapore (Equity & Bonus)
Senior MEMS Packaging Engineer - Singapore (Equity & Bonus)

SiTime Corp. • Singapore

Remote
SGD 70,000 - 110,000
Quarterly bonus
Equity grants
Sr. Engineer, Test Engineering Remote - Singapore
Sr. Engineer, Test Engineering Remote - Singapore

SiTime Corp. • Singapore

Remote
SGD 120,000 - 180,000
Quarterly bonus tied to innovation
Equity grants
Competitive compensation package
Director, Semiconductor Supply Chain Management Remote - Singapore
Director, Semiconductor Supply Chain Management Remote - Singapore

SiTime Corp. • Singapore

Remote
SGD 180,000 - 280,000
Quarterly bonus
Equity grants
Director, Semiconductor Supply Chain Management
Director, Semiconductor Supply Chain Management

SiTime Corp. • Singapore

On-site
SGD 230,000 - 420,000
Quarterly bonus
Equity grants
Quality Engineer II Remote - Singapore
Quality Engineer II Remote - Singapore

SiTime Corp. • Singapore

Remote
SGD 70,000 - 110,000
Equity grants
Quarterly bonus
Quality Engineer II
Quality Engineer II

SiTime • Singapore

On-site
SGD 60,000 - 90,000
Sr. Engineer, Test Engineering
Sr. Engineer, Test Engineering

SiTime • Singapore

On-site
SGD 90,000 - 150,000
Quarterly bonus
Equity grants
Competitive compensation package
Director, Process Support Engineer (Advanced Packaging)
Director, Process Support Engineer (Advanced Packaging)

Applied Materials South East Asia • Singapore

On-site
SGD 300,000 - 420,000