Senior MEMS Packaging Engineer - Singapore (Equity & Bonus)

SiTime Corp.; Singapore; Remote; SGD 70.000 - 110.000; Vollzeit

Benefits dieser Stelle

Quarterly bonus

Equity grants

Zusammenfassung

SiTime in Singapore is seeking a Packaging Process Engineer to drive development, optimization, and sustaining of advanced packaging processes for WLCSP, including bumping and RDL. You will collaborate with multiple teams to ensure high yield and robust manufacturing.

You will apply process capability and SPC methods, define SOPs and control plans, and mentor operators. The role offers exposure to cutting-edge MEMS packaging technologies in a dynamic environment.

Qualifikationen

• Must improve packaging line efficiency and reduce waste.
• Understand materials like plastics and glass and work with packaging machinery.
• Commitment to safety, quality standards, and GMP rules.

Aufgaben

• Develop and optimize packaging processes for WLCSP, including bumping and RDL.
• Perform root cause analysis and implement 8D corrective actions.
• Collaborate with R&D, design, equipment and manufacturing teams for smooth tech transfer.
• Lead or contribute to cross-functional NPI and process improvement projects.
• Evaluate and qualify new materials, equipment, and processes for roadmaps.
• Stay updated on packaging technology trends and best practices.

Kenntnisse

Efficiency improvement

Materials knowledge

GMP compliance

Problem solving

Attention to detail

Communication

Jobbeschreibung

SiTime in Singapore is seeking a Packaging Process Engineer to drive development, optimization, and sustaining of advanced packaging processes for WLCSP, including bumping and RDL. You will collaborate with multiple teams to ensure high yield and robust manufacturing.

You will apply process capability and SPC methods, define SOPs and control plans, and mentor operators. The role offers exposure to cutting-edge MEMS packaging technologies in a dynamic environment.