Sr. Package Engineer Remote - Singapore

SiTime Corp.; Singapore; Remote; SGD 70,000 - 110,000; Full time

Benefits offered by this job

Quarterly bonus

Equity grants

Job summary

SiTime in Singapore is seeking a Packaging Process Engineer to drive development, optimization, and sustaining of advanced packaging processes for WLCSP, including bumping and RDL. You will collaborate with multiple teams to ensure high yield and robust manufacturing.

You will apply process capability and SPC methods, define SOPs and control plans, and mentor operators. The role offers exposure to cutting-edge MEMS packaging technologies in a dynamic environment.

Qualifications

• Must improve packaging line efficiency and reduce waste.
• Understand materials like plastics and glass and work with packaging machinery.
• Commitment to safety, quality standards, and GMP rules.

Responsibilities

• Develop and optimize packaging processes for WLCSP, including bumping and RDL.
• Perform root cause analysis and implement 8D corrective actions.
• Collaborate with R&D, design, equipment and manufacturing teams for smooth tech transfer.
• Lead or contribute to cross-functional NPI and process improvement projects.
• Evaluate and qualify new materials, equipment, and processes for roadmaps.
• Stay updated on packaging technology trends and best practices.

Skills

Efficiency improvement

Materials knowledge

GMP compliance

Problem solving

Attention to detail

Communication

Job description

Timing is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems in sync, but they struggle in harsher, more demanding environments. MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS timing powers over 400 applications, including high-growth ones in AI datacenters, automated driving, industrial and humanoid robots, wearables and IoT.

Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. With more than 4 billion devices shipped, SiTime is changing the timing industry. For more information, visit: www.sitime.com .

Job Summary

We are seeking a highly motivated and skilled Packaging Process Engineer to join SiTime in Singapore, focusing on Bumping, Flip-chip and Wafer-Level Chip Scale Packaging (WLCSP) technologies. In this role, you will be responsible for developing, optimizing, and sustaining advanced packaging processes to ensure high-quality and high-yield manufacturing. This is an excellent opportunity for a hands‑on engineer to make a significant impact on cutting‑edge semiconductor packaging technologies within a dynamic and innovative environment.

Responsibilities

Package Development

• Develop, optimize, and characterize packaging processes for WLCSP technologies, including but not limited to bumping, re‑distribution layer (RDL) formation, underfill, dicing…
• Perform root cause analysis and implement corrective and preventive actions (8D methodology) for process‑related issues and defects.
• Collaborate with R&D, design, equipment, and manufacturing teams to ensure seamless process transfer from development to high‑volume manufacturing.
• Lead or participate in cross‑functional teams for new product introduction (NPI) and process improvement projects.
• Evaluate and qualify new materials, equipment, and processes to support technology roadmaps and production requirements.
• Stay updated with the latest industry trends and advancements in packaging technologies.

Package Manufacture and Sustaining

• Conduct process capability analysis (Cp/Cpk), implement statistical process control (SPC), and drive continuous improvement initiatives to enhance yield, quality, and cost‑efficiency.
• Define and maintain process specifications, control plans, and standard operating procedures (SOPs).
• Provide technical support and training for manufacturing operators and technicians.

Desired Characteristics & Attributes

• Core Skills:
  • Make things more efficient: They should be able to improve how the packaging line works. This means reducing waste, getting more products out the door, and fixing issues that cause shutdowns.
  • Know their stuff: They need to understand different materials like plastic, glass, and cardboard, and how to work with a wide range of machines—from fillers and sealers to labelers.
  • Keep quality high: A great candidate is dedicated to safety and quality standards, following rules like Good Manufacturing Practices (GMP).
• Problem‑solver: They can find and fix complex issues on their own. They're proactive and don't just wait for problems to get worse.
• Detailed and thorough: They pay close attention to every detail to prevent errors that could lead to wasted products or costly mistakes.
• Good communicator: They can work well with everyone on the team—from the factory floor crew to the R&D department. They can explain technical problems clearly to anyone.

Compensation Range

At SiTime, we believe great work deserves great rewards. We offer a comprehensive and highly competitive compensation package designed to attract top talent.

In addition to base salary, this role is eligible for a quarterly bonus tied to the achievement of innovation goals—reflecting our commitment to recognizing meaningful impact. We also offer equity grants, providing a meaningful opportunity to share in the company’s future growth and success.

SiTime is committed to providing equal employment opportunities to all employees and applicants. Employment decisions are based on qualifications, merit, and business needs. We do not discriminate on the basis of any characteristic protected by applicable law.

Learn More about SiTime:

Review the Get to Know SiTime section of our career page to explore our culture, values, and what makes us unique.