Packaging Engineer

Advanced Micro Devices (S) Pte Ltd; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

Advanced Micro Devices (S) Pte Ltd in Singapore is seeking an experienced SMTS Package Design Engineer to lead end-to-end package design for complex products. You will drive substrate layouts, bump maps, and interposer designs, collaborating with SI/PI, mechanical, and SOC teams to ensure performance and cost targets are met.

The ideal candidate brings strong ownership across programs, familiarity with EDA tools, and the ability to apply AI/ML techniques to improve design productivity and

Qualifications

• Experience in leading end-to-end package design and delivery.
• Ability to apply AI/ML and automation to improve design productivity and quality.
• Strong ownership across multiple programs and cross-functional teams.

Responsibilities

• Lead end-to-end package design execution for complex products, meeting performance, cost, quality, and schedule targets.
• Handle multiple concurrent design programs in a fast-paced, high-pressure environment.
• Develop substrate layouts, bump maps, and interposer designs for 2.5D/3D packaging and chiplet architectures.
• Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams.

Skills

Ownership & accountability

Cross-functional collaboration

AI/ML in design

Fast execution

Communication skills

Education

Bachelor's degree in Electrical Engineering or Computer Engineering

Tools

EDA tools

Job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believetechnology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMDis shapingthefuture.

Whetheryou’redesigning next-gen processors, enabling AI breakthroughs, orbringing leading edge products to market, every role at AMD contributes to something bigger— technologythat moves the world forward.Join us and, together, we’ll advance your career.

THE ROLE

Help turn “possibility” into “reality” every day. At AMD, we push the boundaries of what is possible by delivering innovative, high-performance computing solutions across data center, AI, and advanced packaging technologies.

We are seeking a highly experienced SMTS Package Design Engineer to support complex package design execution. This role requires a self-driven technical expert who thrives in a fast-paced, dynamic, and high-pressure environment, and can deliver high-quality designs with speed, precision, and scalability.

The successful candidate will play a key role in advancing AMD’s packaging methodologies by leveraging AI-driven design techniques, automation, and next-generation workflows to address the increasing complexity of heterogeneous integration and advanced packaging architectures.

THE PERSON

The ideal candidate is an experienced package or silicon physical designer who:

• Demonstrates strong ownership and accountability across multiple programs
• Excels in fast-phase execution environments with competing priorities
• Applies AI/ML and automation to improve design productivity and quality
• Operates with minimal supervision while influencing cross-functional teams
• Balances deep technical expertise with strong collaboration and communication skills

KEY RESPONSIBILITIES

Design Execution & Technical Leadership

• Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met
• Handle multiple concurrent design programs in a fast-paced and high-pressure environment
• Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures)
• Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams

Cross-Functional Collaboration

• Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions
• Interface with stakeholders to communicate design status, risks, and mitigation strategies
• Contribute to design reviews, signoff readiness, and tapeout processes

Methodology & Continuous Improvement

• Define and enhance package design methodologies, flows, and best practices
• Drive improvements in layout efficiency, reuse, and design standardization
• Mentor junior engineers and promote engineering excellence across the team

PREFERRED EXPERIENCE

• Experience in designing complex substrate design or Silicon Bridge or Interposers
• Proven ability to execute in multi-project, fast-phased, and high-pressure environments
• Strong experience in advanced packaging technologies:
• Hands-on experience with EDA tools such as:
• Experience working with OSATs, foundries, and substrate vendors
• Solid understanding of Signal Integrity and Power Integrity fundamentals

ACADEMIC CREDENTIALS

• Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field

LOCATION

Singapore

Benefits offered are described:

AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.