Lead AI-Driven Packaging Design Engineer

Advanced Micro Devices (S) Pte Ltd; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

Advanced Micro Devices (S) Pte Ltd in Singapore is seeking an experienced SMTS Package Design Engineer to lead end-to-end package design for complex products. You will drive substrate layouts, bump maps, and interposer designs, collaborating with SI/PI, mechanical, and SOC teams to ensure performance and cost targets are met.

The ideal candidate brings strong ownership across programs, familiarity with EDA tools, and the ability to apply AI/ML techniques to improve design productivity and

Qualifications

• Experience in leading end-to-end package design and delivery.
• Ability to apply AI/ML and automation to improve design productivity and quality.
• Strong ownership across multiple programs and cross-functional teams.

Responsibilities

• Lead end-to-end package design execution for complex products, meeting performance, cost, quality, and schedule targets.
• Handle multiple concurrent design programs in a fast-paced, high-pressure environment.
• Develop substrate layouts, bump maps, and interposer designs for 2.5D/3D packaging and chiplet architectures.
• Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams.

Skills

Ownership & accountability

Cross-functional collaboration

AI/ML in design

Fast execution

Communication skills

Education

Bachelor's degree in Electrical Engineering or Computer Engineering

Tools

EDA tools

Job description

Advanced Micro Devices (S) Pte Ltd in Singapore is seeking an experienced SMTS Package Design Engineer to lead end-to-end package design for complex products. You will drive substrate layouts, bump maps, and interposer designs, collaborating with SI/PI, mechanical, and SOC teams to ensure performance and cost targets are met.

The ideal candidate brings strong ownership across programs, familiarity with EDA tools, and the ability to apply AI/ML techniques to improve design productivity and