Senior Package Health Test Engineer - Advanced Packaging

Micron Memory Malaysia Sdn Bhd; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Micron Memory Malaysia Sdn Bhd in Singapore is seeking a Package Health Test Engineer to contribute to health monitoring, simulation and characterization of advanced packaging. You will perform DFT, data analysis and reliability testing to ensure robust HBM packaging solutions.

The role requires strong hands-on experience with test architectures, electrical failure analysis and scripting skills (Python/MATLAB).

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, or related field.
• 2+ years of semiconductor industry experience in product, packaging or test engineering.
• Experience defining test architectures, coverage, and managing test/probe yield.
• Strong knowledge of product testing, test architecture, and packaging fail modes.
• Hands-on experience with simulation tools and test equipment for package characterization and electrical failure analysis.
• Proficiency in AI/ML tools, statistics, data analysis and scripting (e.g., Python, MATLAB, JMP).
• Excellent written and verbal communication skills.

Responsibilities

• Develop advanced packaging technology strategies focused on Test architecture, coverage and yield.
• Define, validate and optimize test coverage for wafer and die level processes.
• Perform electrical characterization and failure analysis of advanced packages including HBM.
• Identify the need and co-develop new DFTs with cross-functional teams.
• Enhance test fail debugging capabilities to meet probe yield targets.
• Contribute to the APTD product roadmap from test architecture perspective.
• Co-work with APTD PI for Test Vehicle validations; probe coverage readiness for TVs.
• Co-drive Customer test flow readiness activities with external partners.

Skills

Test architecture

Python

Data analysis

AI/ML tools

Scripting

Education

Bachelor’s or Master’s in Electrical Engineering

Tools

Simulation tools

Test equipment

Electrical characterization

Job description

Micron Memory Malaysia Sdn Bhd in Singapore is seeking a Package Health Test Engineer to contribute to health monitoring, simulation and characterization of advanced packaging. You will perform DFT, data analysis and reliability testing to ensure robust HBM packaging solutions.

The role requires strong hands-on experience with test architectures, electrical failure analysis and scripting skills (Python/MATLAB).