Senior/Principal Advanced Packaging Characterization Engineer

Micron Technology

Singapore

On-site

SGD 120,000 - 180,000

Full time

14 days+

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Job summary

Micron Technology, Inc. in Singapore is seeking an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD) to provide package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures.

You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to

Qualifications

  • PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline.

Responsibilities

  • Conduct Electrical Characterization
  • Understand PFA techniques available for de-processing failures
  • Understand assembly and test process
  • Perform electrical verification to confirm failures
  • Establish best known method for de-processing package
  • Provide Data Analysis
  • Understand backend test flows, qualification methodologies and be able to pull relevant information
  • Communicate with Internal/External Groups
  • Document failure analysis techniques used to isolate failure for other groups
  • Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA
  • Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs
  • Provide Technical Expertise
  • Conduct TMO training and FA certification
  • Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.
  • Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.
  • Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.
  • Maintain Equipment Coordinate calibrations (external to Micron)
  • Procure parts as needed
  • Coordinate host vendors to support equipment repair
  • Manage Laboratory
  • Consistently upholds and promotes Micron’s safety standards, ensuring all activities are conducted in a safe and compliant manner.
  • Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.
  • To manage the exhaust and scrubber systems of the FA Lab.
  • To maintain records and procedures as per Micron GOPs

Skills

Electrical characterization
Data analysis
Cross-functional collaboration
Technical mentorship

Education

PhD
Master’s degree
Bachelor’s degree in Materials Science / Chemical Engineering / Electrical/Electronics Engineering

Tools

SEM
EDX
FIB
TEM
AFM
FTIR
XPS
X-ray
CSAM
Ion Milling
delayering
decapsulation techniques

Job description

Micron Technology, Inc. in Singapore is seeking an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD) to provide package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures.

You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to

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