Realtime Metrology & Defect Analysis Engineer

Micron; Singapore; On-site; SGD 42,000 - 60,000; Full time

Job summary

Micron Technology in Singapore is seeking an Engineer for Metrology and Real Time Defects Analysis to drive measurement recipes and provide rapid feedback on product integrity. The role focuses on analytics, experiment design, and cross‑functional collaboration to identify defect sources and improve yields.

The candidate will work with advanced inspection tools, contribute to SPC monitoring, and help optimize tool maintenance and process changes in a fast‑paced semiconductor environment.

Qualifications

• Bachelor’s or advanced degree in Engineering or Science.
• Strong analytical, logical, and critical thinking skills.
• Effective communicator, able to collaborate across all levels.
• Growth mindset with a passion for continuous learning.
• Demonstrated leadership and a track record of impact desirable.

Responsibilities

• Solve yield/quality issues by developing measurement recipes providing quick feedback on product integrity.
• Apply advanced analytics to identify deviations in machinery and processes.
• Design experiments to identify defect sources and formation mechanisms for defectivity improvement.
• Collaborate with engineers across departments to implement breakthrough solutions.
• Integrate AI-enabled tools to improve efficiency, quality, and reliability of measurements.

Skills

Analytical

Communication

Leadership

Growth mindset

Semiconductor knowledge

Education

Bachelor's or advanced degree in Engineering or Science

Tools

AI literacy

Job description

Micron Technology in Singapore is seeking an Engineer for Metrology and Real Time Defects Analysis to drive measurement recipes and provide rapid feedback on product integrity. The role focuses on analytics, experiment design, and cross‑functional collaboration to identify defect sources and improve yields.

The candidate will work with advanced inspection tools, contribute to SPC monitoring, and help optimize tool maintenance and process changes in a fast‑paced semiconductor environment.