Senior Engineer, NTI Metrology

micron semiconductor asia operations pte. ltd.; Singapore; On-site; SGD 120,000 - 170,000; Full time

Job summary

micron semiconductor asia operations pte. ltd. seeks a senior metrology scientist to drive the development and deployment of advanced metrology applications for 3D NAND processes, with emphasis on FIB, AFM, and SEM/WLI.

The role requires leadership in evaluating new metrology systems and integrating AI/ML analytics to close inline gaps and accelerate learning. You will collaborate across Process Integration, Yield, and Manufacturing to deliver scalable characterization solutions and shape future

Qualifications

• Master's or PhD in Materials Science, Mechanical Engineering, Electrical Engineering or Applied Physics.
• Minimum 7 years in semiconductor metrology development with ownership of new metrology applications and inline monitoring solutions incl. FIB and AFM/SEM/WLI.
• Minimum 5 years hands-on experience in Focused Ion Beam (FIB) and at least one other advanced metrology technique (AFM, WLI or SEM).
• Experience developing metrology applications for process characterization, inline monitoring, root-cause analysis and technology transfer.

Responsibilities

• Own development, qualification, and deployment of advanced metrology applications for 3D NAND process development focusing on FIB and AFM/SEM/WLI.
• Lead evaluation and deployment of next-gen metrology systems including FOAK technologies and assess measurement capability, accuracy, repeatability, throughput, automation, and readiness.
• Establish technology roadmaps aligned with future NAND requirements and partner with suppliers and collaborators.
• Identify modeling opportunities using metrology data analytics, AI/ML, to understand failure signatures and impact on yield and reliability.
• Collaborate with Process Integration, Yield Enhancement, Process Development, and Manufacturing to enable rapid deployment of characterization solutions.

Skills

FIB metrology

AFM

SEM

WLI

AI/ML in metrology

Data analytics

Education

Master's degree in Materials Science

PhD in Materials Science / Mechanical / Electrical / Applied Physics

Tools

Metrology equipment

FOAK systems

Job description

Responsibilities:

• Own the development, qualification, and deployment of advanced metrology applications for 3D NAND process development, with primary emphasis on Focused Ion Beam (FIB) and one or more of the following:

• Atomic Force Microscopy (AFM)

• Optical interferometry or White Light Interferometry (WLI)

• Scanning Electron Microscopy (SEM)

• Semiconductor electrical or non-contact characterization methods

• Develop and implement innovative metrology solutions utilizing FIB, AFM, SEM, and related characterization techniques to close inline detection gaps and accelerate process learning.

• Lead the evaluation, qualification, and deployment of next-generation metrology systems and First-of-a-Kind (FOAK) technologies, including assessment of measurement capability, accuracy, repeatability, throughput, automation, and manufacturing readiness across FIB, AFM, SEM, and other advanced metrology platforms.

• Establish and drive technology roadmaps, ensuring alignment with future NAND technology requirements while fostering strong technical partnerships with equipment suppliers and industry collaborators.

• Identify and develop modeling opportunities using metrology, defect detection, artificial intelligence (AI), and machine learning (ML) techniques in conjunction with metrology data analytics to understand electrical failure signatures observed at probe and their impact on product reliability, yield, and performance.

• Collaborate closely with Process Integration, Yield Enhancement, Process Development Engineering and Manufacturing teams to develop innovative characterization solutions and enable rapid technology deployment

Qualifications:

• Master's or PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering or Applied Physics.

• Minimum 7 years of semiconductor metrology development experience with demonstrated ownership and experience developing new metrology applications, recipes, methodologies or inline monitoring solutions across advanced characterization platforms, including FIB and one or more of the following: AFM, SEM, or WLI (not users of Metrology data).

• Minimum 5 years of hands-on experience in Focused Ion Beam (FIB) and at least one additional advanced metrology technique from the following

• Atomic Force Microscopy (AFM)

• While Light Interferometry (WLI)

• Scanning Electron Microscopy (SEM)

• Demonstrated track record developing advanced semiconductor metrology applications for process characterization, inline monitoring, root-cause analysis, yield improvement, reliability investigations, and technology transfer, including qualification of new metrology technologies and direct engagement with suppliers to establish application capability and technology roadmaps.

• Candidates whose experience is primarily limited to process engineering, yield engineering, failure analysis, or data analysis roles without direct metrology application development responsibility will not be considered.