Senior Metrology Engineer - FIB/SEM & 3D NAND

Micron Technology; Singapore; On-site; SGD 150,000 - 190,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks a seasoned semiconductor metrology engineer to lead development of advanced metrology applications for 3D NAND, with emphasis on FIB and AFM/SEM/WLI techniques.

You will drive qualification, deployment, and collaboration with Process Integration, Yield Enhancement, Process Development Engineering, and Manufacturing to accelerate learning, close inline gaps, and improve device reliability and yield.

Qualifications

• 7+ years in semiconductor metrology development with ownership of new applications.
• 5+ years hands-on experience in FIB and at least one of AFM/SEM/WLI.
• Proven track record developing metrology applications for process characterization and inline monitoring.
• Experience coordinating with suppliers to establish capabilities and roadmaps.

Responsibilities

• Own development, qualification, and deployment of advanced metrology apps for 3D NAND, focusing on FIB and AFM/SEM/WLI.
• Lead evaluation, qualification, and deployment of next-generation metrology systems including FOAK technologies.
• Establish technology roadmaps aligned with future NAND requirements and supplier partnerships.
• Identify modeling opportunities using metrology data analytics, AI, and ML to understand failure signatures impact on yield and reliability.
• Collaborate with Process Integration, Yield Enhancement, Process Development Engineering and Manufacturing to develop innovative characterization solutions.

Skills

Semiconductor metrology

FIB expertise

AFM

SEM

WLI

AI/ML in metrology

Cross-functional collaboration

Education

Master's or PhD in relevant fields

Tools

FIB equipment

AFM instrument

SEM instrument

Job description

Micron Technology, Inc. in Singapore seeks a seasoned semiconductor metrology engineer to lead development of advanced metrology applications for 3D NAND, with emphasis on FIB and AFM/SEM/WLI techniques.

You will drive qualification, deployment, and collaboration with Process Integration, Yield Enhancement, Process Development Engineering, and Manufacturing to accelerate learning, close inline gaps, and improve device reliability and yield.